A method for improving that alignment between a soft bonding plate layer and a hard bonding plate layer

A soft-rigid combination board and alignment technology, which is used in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., to ensure alignment, improve accuracy, and improve lamination quality.

Active Publication Date: 2018-12-11
SHENZHEN SUNTAK MULTILAYER PCB
View PDF4 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the existing technical defects and provide a method for improving the alignment between the layers of the soft-rigid bonded board. This method solves the problem of p

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0026] This embodiment provides a method for manufacturing a rigid-flex board, including a method for improving the alignment between layers of a rigid-flex board. The specific process is as follows:

[0027] (1) Cutting: According to the panel size of 520mm×620mm, the soft board core board and the hard board core board are cut out. The thickness of the soft board core board is 0.1mm, and the thickness of the outer copper foil is 0.5OZ. The soft board core board includes The soft board area and the soft-hard combination area; the thickness of the hard board core board is 0.18mm, and the thickness of the outer copper foil is 0.5OZ.

[0028] (2), inner layer circuit production (negative film process): inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the soft board core board, the film thickness of the photosensitive film is controlled to 8 μm, and a fully automatic exposure machine is used to 5 - 6-grid exposure ruler (21-grid exposu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for improving the alignment between a soft bonding plate layer and a hard bonding plate layer, which comprises the following steps: manufacturing an inner layer circuit on a soft plate core plate; In the finished soft-hard bonding plate, the soft-board core plate comprises a soft-board area and a soft-hard bonding area; The coating film is pressed on the soft platearea of the soft plate core plate, and then the expansion and contraction coefficient of the soft plate core plate is measured. The inner layer circuit is fabricated on the hard board core board, andthe exposure compensation is carried out according to the expansion and contraction coefficient of the soft board core board when the inner layer circuit is fabricated. Using the same OPE punching machine to drill rivet holes at corresponding riveting positions on the soft plate core plate and the hard plate core plate respectively; Flexible and hard core plates are pre-laminated with non-flowingadhesive PP, riveted by rivets, and then compressed to produce plates. The method of the invention solves the deviation problem of the pressing counterpoint holes caused by pressing the covering film, improves the pressing quality of the soft-hard bonding plate, and reduces the deviation scrap rate of the soft-hard bonding plate layer.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving the alignment between layers of a rigid-flex board. Background technique [0002] In the production process of the flexible and rigid board, it is necessary to press the hard board and the soft board. The traditional production process of the soft board before lamination is: material cutting-inner layer graphics-OPE punching-inner layer AOI-browning- Covering film-fast pressing-browning-post-process; among them, the purpose of OPE punching is to punch out the rivet holes and slot holes on the edge of the board for the press-fit positioning of hard and soft boards in the post-process, so as to Control precise alignment between layers. [0003] According to the above-mentioned traditional process, the OPE punching is performed first, so that in the subsequent rapid pressing process of the cover film, the soft board will expand and sh...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K3/4691
Inventor 李红娇苟成宋建远胡荫敏何为
Owner SHENZHEN SUNTAK MULTILAYER PCB
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap