A method for improving that alignment between a soft bonding plate layer and a hard bonding plate layer

Abstract

The invention discloses a method for improving the alignment between a soft bonding plate layer and a hard bonding plate layer, which comprises the following steps: manufacturing an inner layer circuit on a soft plate core plate; In the finished soft-hard bonding plate, the soft-board core plate comprises a soft-board area and a soft-hard bonding area; The coating film is pressed on the soft platearea of the soft plate core plate, and then the expansion and contraction coefficient of the soft plate core plate is measured. The inner layer circuit is fabricated on the hard board core board, andthe exposure compensation is carried out according to the expansion and contraction coefficient of the soft board core board when the inner layer circuit is fabricated. Using the same OPE punching machine to drill rivet holes at corresponding riveting positions on the soft plate core plate and the hard plate core plate respectively; Flexible and hard core plates are pre-laminated with non-flowingadhesive PP, riveted by rivets, and then compressed to produce plates. The method of the invention solves the deviation problem of the pressing counterpoint holes caused by pressing the covering film, improves the pressing quality of the soft-hard bonding plate, and reduces the deviation scrap rate of the soft-hard bonding plate layer.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving the alignment between layers of a rigid-flex board. Background technique [0002] In the production process of the flexible and rigid board, it is necessary to press the hard board and the soft board. The traditional production process of the soft board before lamination is: material cutting-inner layer graphics-OPE punching-inner layer AOI-browning- Covering film-fast pressing-browning-post-process; among them, the purpose of OPE punching is to punch out the rivet holes and slot holes on the edge of the board for the press-fit positioning of hard and soft boards in the post-process, so as to Control precise alignment between layers. [0003] According to the above-mentioned traditional process, the OPE punching is performed first, so that in the subsequent rapid pressing process of the cover film, the soft board will expand and sh...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the existing technical defects and provide a method for improving the alignment between the layers of the soft-rigid bonded board. This method solves the problem of pressing alignment hole deviation caused by pressing the covering film, and improves It improves the pressing quality of the soft-rigid combination board and reduces the partial scrap rate of the soft-rigid combination board.