Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

An exposure method for effectively preventing photoresist from contaminating a mask plate

An exposure method and photoresist technology, which are applied in microlithography exposure equipment, photolithographic process exposure devices, optics, etc., can solve the problems of reducing exposure effect, mask contamination, and increasing photoresist uniformity, etc. Good exposure, improve sharpness, prevent pollution

Inactive Publication Date: 2018-12-14
何琪
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an exposure method that can effectively prevent photoresist from polluting the mask, which can effectively prevent photoresist from polluting the mask, improve the definition of exposure patterns, and have better exposure effects. , reduce ultraviolet energy, absorb ultraviolet rays, increase the uniformity of photoresist distribution on the substrate surface, reduce the fluidity of photoresist distribution on the substrate surface, absorb xylene volatilized from photoresist, etc., which solves the problem of easy masking Contaminated by photoresist, which reduces its service life and exposure clarity, thereby reducing the exposure effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An exposure method for effectively preventing photoresist from contaminating a mask plate
  • An exposure method for effectively preventing photoresist from contaminating a mask plate
  • An exposure method for effectively preventing photoresist from contaminating a mask plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] A kind of exposure method that effectively prevents photoresist from polluting mask plate, see figure 1, including an exposure device 1, the exposure device 1 includes a box body 11, a box door is opened on the front side wall of the box body 11, one side of the box door is hinged with the box body 11 through a hinge, and the other side is connected with the box body by a pressing spring. The body 11 is not fixedly connected, and a box door handle 12 is...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of exposure equipment, and discloses a method for effectively preventing photoresist from contaminating a mask platee, an exposure means is included, the exposure device comprises a box body, An ultra-high pressure mercury lamp is fixedly installed on the top in the box body, A mask plate is arranged just below the ultra-high pressure mercury lamp, a first pressure bar and a second pressure bar are symmetrically arranged in the middle parts of both sides of the mask plate, An exposure stage is arranged just below the mask plate, a groove is arrangedon the upper surface of the exposure stage, a substrate is arranged in the groove, symmetrical guide rail grooves are respectively arranged on both sides of the groove, and sliders symmetrically arranged on both sides of the bottom end of the scraper plate are respectively slidably connected in the guide rail grooves; A light-transmitting plate is arranged between the substrate and the mask plate; A first air outlet in the left side wall of the box body is connected with a cold air outlet of the refrigeration device; The second ventilation port in the right side wall of the box body is connected with the air inlet of the gas purification device through the air guide pipe provided with the air suction pump. The invention solves the problem that the mask plate is liable to be contaminated by photoresist.

Description

technical field [0001] The invention relates to the technical field of exposure equipment, in particular to an exposure method for effectively preventing photoresist from polluting a mask plate. Background technique [0002] Exposure machine refers to the machine equipment that transfers the image information on the film or other transparent body to the surface coated with photosensitive material by turning on the light and emitting ultraviolet rays of UVA wavelength. [0003] During the working process of the exposure machine, when the mask plate is in direct contact with the photoresist layer, the exposed pattern is equivalent to the pattern resolution on the mask plate, but the mask plate is directly in contact with the photoresist layer, and the mask plate It is easy to be polluted by photoresist, and then accelerates the wear of the mask plate, making the mask plate easily damaged, thereby reducing the clear image of the exposed pattern, resulting in the technical probl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/70916G03F7/70808G03F7/70858G03F7/70933
Inventor 何琪
Owner 何琪
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products