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Chemical mechanical polishing apparatus and working method thereof

A technology of chemical machinery and grinding devices, which is applied in the direction of grinding devices, grinding machine tools, manufacturing tools, etc., can solve the problems of short service life of grinding pads, and achieve the effect of improving service life and less wear

Inactive Publication Date: 2018-12-18
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the service life of the polishing pad in the existing chemical mechanical polishing device is relatively short

Method used

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  • Chemical mechanical polishing apparatus and working method thereof
  • Chemical mechanical polishing apparatus and working method thereof
  • Chemical mechanical polishing apparatus and working method thereof

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Embodiment Construction

[0023] As mentioned in the background art, in the late stage of wafer grinding by using the existing chemical mechanical grinding device, the grinding rate decreases seriously.

[0024] figure 1 It is a structural schematic diagram of a chemical mechanical grinding device.

[0025] Please refer to figure 1 , Grinding disk 100 (Platen), described grinding disk 100 comprises bearing surface (not marked among the figure); Be positioned at the grinding pad 102 (Polish Pad) of described bearing surface surface, described grinding pad 102 comprises opposite non-grinding surface (not shown in the figure) and grinding surface A, described non-grinding surface and carrying surface fit together; The grinding head 104 that is used to clamp wafer, described grinding head 104 is opposite to grinding surface A; For driving described The chuck 105 that the grinding head 104 rotates makes the grinding head 104 move relative to the grinding surface A; the grinding liquid supply pipe 106 for ...

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PUM

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Abstract

The invention relates to a chemical mechanical polishing apparatus and a working method thereof. The chemical mechanical polishing apparatus comprises a polishing disc comprising a bearing surface, apolishing pad located on the surface of the bearing surface, a trimmer used for conducting surface treatment on the polishing face and a vibration device located in the polishing disc; and the polishing pad comprises a non-polishing surface and a polishing surface which are opposite, and the non-polishing surface is attached to the bearing surface. The service life of the polishing pad can be prolonged by using the chemical mechanical polishing apparatus.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a chemical mechanical polishing device and a working method thereof. Background technique [0002] The Chemical Mechanical Planarization (CMP) process is a planarization process. Since it was introduced into the integrated circuit manufacturing process in 1990, after continuous practice and development, it has become a key process to promote the continuous shrinking of the integrated circuit technology node. At present, CMP has been widely used in the planarization of front trench isolation structure, gate electrode planarization, tungsten plug planarization and copper interconnection planarization process. The CMP process is also applied to remove thin film layers on the surface of the substrate. [0003] However, the service life of the polishing pad in the existing chemical mechanical polishing device is relatively short. Contents of the invention [0004] The te...

Claims

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Application Information

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IPC IPC(8): B24B37/00B24B37/34B24B1/00
CPCB24B37/00B24B1/00B24B37/34
Inventor 郭松辉沈新林吴龙江林宗贤
Owner HUAIAN IMAGING DEVICE MFGR CORP