Optical emission components and optical modules

Abstract

The present invention relates to the field of optical communication technology, and provides an optical emission component, including an LD chip component, an optical wavelength division multiplexer, a first encapsulation shell, and a second encapsulation shell; the first encapsulation shell and the second encapsulation shell are fixedly connected to Forming a first chamber for packaging LD chip components and a second chamber for packaging an optical wavelength division multiplexer, the first chamber is located in the first packaging shell, and the second chamber is located in the second packaging inside the shell. An optical module is also provided, which includes a housing, and further includes a light receiving component and the above-mentioned light emitting component, and the light receiving component and the light emitting component are both arranged on the housing. The present invention adopts a two-stage structure, separates the LD chip component and the optical wavelength division multiplexer, and divides the processing of the optical signal into two steps, which not only improves the yield rate, but also facilitates the implementation of the installation process; by using the optical fiber adapter The assembly tolerance can be effectively compensated by using the flexibility of the optical fiber, the stress can be eliminated, and the problem of component stress loss can be avoided.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an optical emitting component and an optical module. Background technique [0002] Higher speed, higher integration, and smaller package have always been the development direction of high-speed optical modules. At present, 100G QSFP28 optical transceiver modules with small package sizes have been applied in large quantities in data centers and Ethernet networks. The next generation of optical modules will be developed in the future. In a few years, it will be 200G, 400G, and then develop to 800G. In order to meet the high-density requirements of the optical interface of the optical switch, the package of 200G, 400G and even 800G optical modules must maintain the same size as QSFP28. A very high challenge. Among the four main components of the optical module, the light emitting component, the light receiving component, the PCB, and the packaging shell, the packaging...

AI Technical Summary

Problems solved by technology

As the speed increases, the application of traditional packaging methods in the next generation of optical modules becomes difficult

[0004] From the perspective of signal yield, considering that with the progress of the times, the required rate is getting higher and higher, it is necessary to increase the number of light wave multiplexing, so that more LD chips need to be integrated in a miniaturized size, then It will inevitably cause too many devices in the housing, and those skilled in the art know that the more devices, the lower the yield rate of the processed optical signal will be, and such dense installation will also affect the implementation of the installation process, affecting Batch production of modules

[0005] From the perspective of signal quality, on the one hand, FPC generally has a longer length to accommodate assembly, and this length will cause more signal loss. On the other hand, FPC will introduce multiple impedance discontinuities such as welding pads. These discontinuities The point also significantly increases the high-frequency signal loss, and as the rate increases, the impact of this loss becomes greater and greater

[0006] From the structural point of view, in order to adapt to the design of welding FPC pads, the design should not be too small, resulting in the reserved pads on the PCB occupying a large amount of layout space. Also, as the module speed increases, the number of channels of the module will increase. This kind of space occupation will become more and more serious, making it difficult to miniaturize the package of the module

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