Temperature control device for semiconductor production

A technology of temperature control equipment and semiconductors, which is applied in the direction of temperature control, electric temperature control, lighting and heating equipment, etc. It can solve the problems of large load of refrigeration system and unfavorable energy saving, so as to reduce input power and load. Effect

Pending Publication Date: 2018-12-18
BEIJING JINGYI AUTOMATION EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current temperature control equipment for semiconductor production only uses the refrigeration system to cool down the load equipment, resulting in a large load of the refrigeration system, which is not conducive to energy saving

Method used

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  • Temperature control device for semiconductor production

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Embodiment Construction

[0023] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0024] The present disclosure provides a temperature control device for semiconductor production, which is used to control the temperature of a load device 12 (eg, a semiconductor processing reaction chamber). The temperature control equipment may include a refrigeration system, a precooler 8 and a circulating water pump 10 . The precooler 8 is connected in series on the first factory water branch road, and the precooler 8 has a factory water inlet 81 , a factory water outlet 82 , a circulating fluid inlet 83 and a circulating fluid outlet 84 . The condenser 2 is connected in series on the second plant water branch road, and the condenser 2 has a plant water...

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Abstract

The invention relates to a temperature control device for semiconductor production for controlling the temperature of a load device. The temperature control device comprises a refrigeration system, apre-cooler and a circulating water pump, wherein the pre-cooler is connected in series on a first water branch; the refrigeration system comprises a compressor, a condenser, an electronic expansion valve, and an evaporator which are connected in series as a coolant circuit; and the evaporator also forms a circulating fluid circuit in series with the pre-cooler, the circulating water pump, and theload device, and the pre-cooler is located upstream of the evaporator. According to the temperature control device for semiconductor production, when a circulating fluid enters the temperature controldevice, it first exchanges heat with lower temperature factory water through the pre-cooler, thereby pre-cooling the circulating fluid with the low temperature factory water, and then further cools the circulating liquid through the refrigeration system. In this way, the load of the refrigeration system and the input power of the temperature control device can be reduced to achieve an energy saving effect.

Description

technical field [0001] The present disclosure relates to the field of semiconductor production, and in particular, to a temperature control device for semiconductor production. Background technique [0002] At present, when controlling the temperature of the semiconductor production process, it is necessary to use special temperature control equipment. Temperature control equipment is mainly used in ETCH (etching), PVD (physical vapor deposition), CVD (chemical vapor deposition) and other semiconductor processing processes to provide high-precision and stable circulating liquid for load equipment (such as semiconductor processing reaction chamber) inlet temperature. The current temperature control equipment for semiconductor production only uses a refrigeration system to cool down the load equipment, resulting in a large load of the refrigeration system, which is not conducive to energy saving. Contents of the invention [0003] The purpose of the present disclosure is t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/19G05D23/185G05D23/30F25B43/00F25B41/00F25B41/40
CPCG05D23/185G05D23/1925G05D23/30F25B41/00F25B43/00F25B43/006Y02B30/70Y02P80/10
Inventor 何茂栋芮守祯刘紫阳张申孙华敏赵力行邹昭平蒋俊海于浩
Owner BEIJING JINGYI AUTOMATION EQUIP CO LTD
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