Temperature control device for semiconductor production

Abstract

The invention relates to a temperature control device for semiconductor production for controlling the temperature of a load device. The temperature control device comprises a refrigeration system, apre-cooler and a circulating water pump, wherein the pre-cooler is connected in series on a first water branch; the refrigeration system comprises a compressor, a condenser, an electronic expansion valve, and an evaporator which are connected in series as a coolant circuit; and the evaporator also forms a circulating fluid circuit in series with the pre-cooler, the circulating water pump, and theload device, and the pre-cooler is located upstream of the evaporator. According to the temperature control device for semiconductor production, when a circulating fluid enters the temperature controldevice, it first exchanges heat with lower temperature factory water through the pre-cooler, thereby pre-cooling the circulating fluid with the low temperature factory water, and then further cools the circulating liquid through the refrigeration system. In this way, the load of the refrigeration system and the input power of the temperature control device can be reduced to achieve an energy saving effect.

Description

technical field [0001] The present disclosure relates to the field of semiconductor production, and in particular, to a temperature control device for semiconductor production. Background technique [0002] At present, when controlling the temperature of the semiconductor production process, it is necessary to use special temperature control equipment. Temperature control equipment is mainly used in ETCH (etching), PVD (physical vapor deposition), CVD (chemical vapor deposition) and other semiconductor processing processes to provide high-precision and stable circulating liquid for load equipment (such as semiconductor processing reaction chamber) inlet temperature. The current temperature control equipment for semiconductor production only uses a refrigeration system to cool down the load equipment, resulting in a large load of the refrigeration system, which is not conducive to energy saving. Contents of the invention [0003] The purpose of the present disclosure is t...

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Problems solved by technology

The current temperature control equipment for semiconductor production only uses the refrigeration system to cool down the load equipment, resulting in a large load of the refrigeration system, which is not conducive to energy saving

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