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A vacuum bag packaging method for autoclave molding

A technology of autoclave forming and encapsulation method, which is applied in the field of autoclave forming composite materials, can solve the problems of affecting the molding quality of final products, easy opening and air leakage, and the need for inspection and repair, so as to reduce product defects or even scrap, improve Quality and qualification rate, the effect of solving the problem of vacuum leakage

Active Publication Date: 2020-11-10
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, this high-temperature-resistant sealing putty has poor viscosity at room temperature, and inspection and repair are often required after packaging, which increases labor costs; on the other hand, since the putty softens at high temperatures, the adhesive performance will be greatly reduced. In the inflated environment, it is easy to open and leak air, which seriously affects the molding quality of the final product and brings great difficulties to the high-temperature autoclave molding process.

Method used

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  • A vacuum bag packaging method for autoclave molding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment implements the vacuum bag packaging of high temperature autoclave through the following steps:

[0050] 1) Spread carbon fiber / high temperature resistant polyimide resin (resistant to 400°C) prepreg on the mold, and place release cloth and air felt in sequence;

[0051] 2) Paste a ring of 400°C high-temperature sealing putty (purchased from American general selants) and 200°C medium temperature resistant sealing putty (purchased from American general selants) around the edge of the mold in sequence, the latter is located on the outer ring of the former;

[0052] 3) Coat a layer of about 0.5mm thick organic silicone sealant with a thickness of about 0.5mm as a sealing adhesive around the inner ring of the 400°C high temperature resistant sealing putty;

[0053] 4) Use 400°C high-temperature sealing putty and 200°C medium-temperature sealing putty to seal the vacuum bag on the mold, vacuumize to below -0.09MPa, and the vacuum bag is close to the sealant ar...

Embodiment 2

[0058] The method is basically the same as in Example 1, except that the high-temperature-resistant polyimide resin is replaced by a double-horse resin that can also withstand 400°C.

[0059] Repeated 9 times independently, and no vacuum leak occurred during the whole process of each repetition.

Embodiment 3

[0061] Carry out in basically the same manner as in Example 1, except that no 400°C high-temperature sealing putty is pasted.

[0062] Repeated 10 times independently. During the whole process of each repetition, it was found that the seal of the 200°C medium temperature sealing putty was damaged every time, but only 2 times the seal of the sealing adhesive located on the inner ring was damaged. Happening.

[0063] Example 3

[0064] Carry out in the same manner as in Example 1, except that the 200°C medium and low temperature sealing putty is not pasted.

[0065] Repeated 13 times independently. In the whole process of each repetition, it was found that the seal of the 400°C high temperature resistant sealing putty was damaged only 3 times, and the seal of the sealing adhesive located on the inner ring was damaged in 1 time. Case.

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Abstract

The invention relates to a vacuum bag encapsulating method for autoclave molding. The method comprises steps as follows: a preformed member subjected to impregnating is put in the position close to the center of a die; diaphragm cloth and ventilated felt are put on the preformed member in sequence; at least one circle of sealing putty and at least one circle of a seal adhesive are applied betweenthe outer edge of the preformed member and the outer edge of the die along the periphery of the die; a vacuum bag is encapsulated on the die by the at least one circle of sealing putty and the at least one circle of the seal adhesive; the vacuum bag is vacuumized by an air slot, and the at least one circle of the seal adhesive is enabled to be cured by vacuum pressure formed by vacuumizing. With the adoption of the encapsulating method, success rate of vacuum bag encapsulating at the room temperature can be remarkably increased, vacuum leakage during high-temperature curing molding of a composite material in the prior art is effectively reduced, quality of a formed composite material product is improved, qualification rate of the formed composite material product is increased, and the method has obvious economic benefit.

Description

technical field [0001] The invention specifically relates to a vacuum bag sealing method for high-temperature autoclave forming, and belongs to the technical field of autoclave forming composite materials. Background technique [0002] The autoclave molding process is one of the widely used molding methods for resin matrix composites in the aerospace field. The working principle of autoclave molding is to use high-temperature compressed gas to heat and pressurize the composite material prepreg in the vacuum bag to complete the curing and molding of the composite material. Therefore, the packaging of vacuum bags is one of the key steps in the autoclave forming process. At present, the commonly used packaging method is to seal the vacuum bag with sticky sealing putty, which has the advantages of simple operation and easy cleaning after curing. [0003] However, when autoclave molding such as high-temperature-resistant resin-based composite materials such as polyimide, the hi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/34B29C70/54
CPCB29C70/342B29C70/54
Inventor 汪东武海生王国勇柯红军李丽英田正刚赵跃杰
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH