A vacuum bag packaging method for autoclave molding
A technology of autoclave forming and encapsulation method, which is applied in the field of autoclave forming composite materials, can solve the problems of affecting the molding quality of final products, easy opening and air leakage, and the need for inspection and repair, so as to reduce product defects or even scrap, improve Quality and qualification rate, the effect of solving the problem of vacuum leakage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0049] This embodiment implements the vacuum bag packaging of high temperature autoclave through the following steps:
[0050] 1) Spread carbon fiber / high temperature resistant polyimide resin (resistant to 400°C) prepreg on the mold, and place release cloth and air felt in sequence;
[0051] 2) Paste a ring of 400°C high-temperature sealing putty (purchased from American general selants) and 200°C medium temperature resistant sealing putty (purchased from American general selants) around the edge of the mold in sequence, the latter is located on the outer ring of the former;
[0052] 3) Coat a layer of about 0.5mm thick organic silicone sealant with a thickness of about 0.5mm as a sealing adhesive around the inner ring of the 400°C high temperature resistant sealing putty;
[0053] 4) Use 400°C high-temperature sealing putty and 200°C medium-temperature sealing putty to seal the vacuum bag on the mold, vacuumize to below -0.09MPa, and the vacuum bag is close to the sealant ar...
Embodiment 2
[0058] The method is basically the same as in Example 1, except that the high-temperature-resistant polyimide resin is replaced by a double-horse resin that can also withstand 400°C.
[0059] Repeated 9 times independently, and no vacuum leak occurred during the whole process of each repetition.
Embodiment 3
[0061] Carry out in basically the same manner as in Example 1, except that no 400°C high-temperature sealing putty is pasted.
[0062] Repeated 10 times independently. During the whole process of each repetition, it was found that the seal of the 200°C medium temperature sealing putty was damaged every time, but only 2 times the seal of the sealing adhesive located on the inner ring was damaged. Happening.
[0063] Example 3
[0064] Carry out in the same manner as in Example 1, except that the 200°C medium and low temperature sealing putty is not pasted.
[0065] Repeated 13 times independently. In the whole process of each repetition, it was found that the seal of the 400°C high temperature resistant sealing putty was damaged only 3 times, and the seal of the sealing adhesive located on the inner ring was damaged in 1 time. Case.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
