A packaging process of nox sensor chip

Abstract

The invention discloses a packaging process for a NOX sensor chip, and relates to the field of sensor chip sealing. , a first pad is arranged in the connection groove, the end of the first pad away from the sensor chip penetrates the substrate and is connected with a first lead, a sealing member is arranged on the upper side of the substrate, a sealing groove is opened on the lower surface of the sealing member, and a sealing groove is arranged in the sealing groove There is a second dielectric layer and a third solder ball bump, the third solder ball bump is located directly above the third pad, and the left and right ends of the lower surface of the sealing plate are symmetrically arranged with a first medium layer, a second solder ball bump and a connection The connection bump is located outside the second solder ball bump, and the lower end surface of the connection bump is fixed with the first solder ball bump. The invention has good encapsulation effect, prevents moisture from entering into the airtight cavity formed by the substrate and the sealing member, thereby increasing the service life of the sensor chip and reducing the defective rate.

Description

technical field [0001] The invention relates to the field of sensor chip sealing, in particular to a NOX sensor chip packaging process. Background technique [0002] There are various emissions such as nitrogen oxides (eg NO and NO 2 ) in the exhaust of internal combustion engines. In order to reduce emissions from motor vehicles, emissions are regulated through the use of exhaust system components such as catalytic converters. In addition, emissions in exhaust gas are detected using various gas sensors including NOx sensors. [0003] The NOX sensor is a very important sensor in automobiles, which is used to detect the concentration of NOX in automobile exhaust emissions. The standards and regulations introduced by countries around the world are becoming more and more stringent to address the environmental pollution caused by vehicle exhaust emissions. This sensor, based on a ceramic sensing element, measures the NOX concentration in the vehicle's exhaust and sends an inp...

AI Technical Summary

Problems solved by technology

This type of packaging has no connection structure, poor sealing effect, and no protection of the dielectric layer. The sensor chip cannot be sealed in the airtight cavity formed by the seal, which will lead to chip contamination and the entry of moisture, thereby reducing the sensor chip. The life of the chip, and the sensor chip is not detected and positioned in the packaging process, it is easy to cause packaging failure due to the movement of the sensor chip, and the packaging process needs to be improved. Therefore, we propose a NOX sensor chip packaging process to solve the above problems

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