Backlight and manufacturing method thereof, and display device

A backlight and liquid crystal display panel technology, which is applied to the housing with display/control unit, optics, static indicators, etc., can solve the problem that the light-emitting device cannot emit light, reduce the probability of poor contact, and improve the yield rate Effect

Active Publication Date: 2019-01-01
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a backlight source and its manufacturing method, and a display device, which are used to solve the problem that some light-emitting devices cannot emit light due to warping of the FPC or PCB in the direct-lit backlight module

Method used

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  • Backlight and manufacturing method thereof, and display device
  • Backlight and manufacturing method thereof, and display device
  • Backlight and manufacturing method thereof, and display device

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] Some embodiments of the present disclosure, such as figure 1 As shown, a backlight 01 is provided, and the backlight 01 includes a base substrate 10 . The base substrate 10 can be a glass substrate or a transparent or translucent material whose hardness is equivalent to that of a glass substrate, such as sapphire, ceramics, or a substrate made of organic resin materials.

[0033] In addition, on the above-mentioned base substrate 10 such as figure 1 A...

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Abstract

The embodiment of the invention provides a backlight and a manufacturing method thereof, and a display device, and relates to the technical field of display. The problem that an FPC or a PCB in a direct type backlight module is warped, such that some light emitting devices cannot emit light is solved. The backlight comprises a substrate, and a plurality of dimming areas are divided on the substrate. The backlight further comprises a plurality of first routes, a plurality of second routes, a plurality of miniature light emitting devices located in the dimming areas, first common polar lines andsecond common polar lines, which are arranged on the substrate. The first electrodes of the plurality of miniature light emitting devices located in the same dimming areas are electrically connectedwith the first common polar lines, and the second electrodes are electrically connected with the second common polar lines. The first common polar lines of any two dimming areas are electrically connected with different first routes. The second common polar lines of the plurality of dimming areas are electrically connected with the same second route.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a backlight source, a manufacturing method thereof, and a display device. Background technique [0002] TFT-LCD (Thin Film Transistor Liquid Crystal Display, Thin Film Transistor Liquid Crystal Display), as a flat panel display device, has become more and more popular due to its small size, low power consumption, no radiation and relatively low production cost. It is widely used in the field of high-performance display. [0003] TFT-LCD backlight modules are divided into direct-type and side-type. At present, direct-type backlight modules (Back Light Unit, BLU) can be installed on flexible printed circuit boards (Flexible Printed Circuit, FPC) or printed A light emitting device on a printed circuit board (PCB). Since the FPC or PCB is prone to warping, some light-emitting devices at the warped position cannot emit light, reducing the yield of the backlight module. Contents o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357
CPCG02F1/133603G02F1/133612G09G3/3426G09G2300/0426G02F1/133601G09G3/22H05K5/0017
Inventor 李亚飞高博李沛王光泉孙海威陈明董学孙文佳刘金星
Owner BOE TECH GRP CO LTD
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