Lead frame and manufacturing method thereof
A technology of lead frame and frame, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as distortion and deformation, and achieve the effect of large degree of design freedom
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no. 1 approach
[0079] figure 1 It is an explanatory diagram conceptually showing an example of a main part configuration of a lead frame according to an embodiment of the present invention, figure 1 (a) is a plan view showing the portion where the half-etching process is performed, figure 1 (b) is the figure observed from obliquely below, figure 1 (c) of figure 1 M-M cross-sectional view of (a). figure 2 to show in more detail figure 1 An explanatory diagram of the configuration of the lead wire connected to the end of the dam in the lead frame, figure 2 (a) is a perspective view showing that the half-etched side is on top, figure 2 (b) is a top view showing the half-etched side on top, figure 2 (c) of figure 2 N-N cross-sectional view of (b).
[0080] The lead frame of this embodiment is a lead frame constituting a product unit in a multi-row type lead frame, such as figure 1 As shown, a bank 2 and a lead wire 1 connected to the bank 2 are provided. It should be noted,...
Embodiment 1
[0100] The thin-walled portion of the lead frame of Example 1 was manufactured by half-etching a predetermined portion of one surface of a metal plate as a material. Specifically, for the embankment 2 with a total length of 13.0 mm×a width of 0.200 mm, the embankment 2 is surrounded by the side in the width direction of the end of the lead wire 1 connected to the embankment 2 and the side in the width direction of the embankment 2. part, and the first part 2a formed by merging the parts near the end of the lead wire 1 connected to the bank 2 (from both ends of the bank 2 in the width direction to the outside until 0.050mm), for the corresponding from the lead wire 1 A region other than the cross section 3 that crosses the bank 2 with a width of 0.100 mm narrower than the width of the end of the lead wire 1 connected to the bank 2 from both ends in the width direction to 0.050 mm, and A half-etching process was performed at a depth of 0.110 mm from the side of the metal plate a...
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