A soft flexible board capable of avoiding a poor pad butt joint and an assembly fixture thereof

Abstract

The invention relates to a soft flexible board capable of avoiding a poor pad butt joint and an assembly fixture thereof. The soft flexible board body comprises a flexible soft board body which adoptsa double-panel structure. A main via region and a standard pad region are arranged on the front face of the soft flexible board body, a group of electrical networks is arranged in the main via regioncorresponding to the electrical networks of optical device pins to be manufactured or tested, and a group of electrical networks corresponding to the main via pads is arranged in the standard pad region. A test pad area is arranged on the back surface of the soft flexible board body, and a group of test pads corresponding to the standard pad electrical network are arranged in the test pad area. The invention has the advantages that the double panel structure is adopted, the space is fully utilized, the test pad area is arranged on the back side, the reliability and the yield of the flexible soft board body test are not required to be met under the condition of expanding the non-standard pad area, and the test standard of the industry can be met.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a flexible soft board and an assembling fixture thereof which avoid bad connection of pads. Background technique [0002] Flexible board not only has excellent mechanical properties, but also has excellent electrical properties. Flexible boards can be moved, bent, and twisted without damaging the wires, and can have different shapes and special package sizes. Today, as the transmission rate of optical communication is getting higher and higher, the traditional product design can no longer meet the needs of high-speed signal transmission. In low-speed applications, the flexible board mainly plays the role of a connection, while in high-speed applications, the quality of high-speed signal transmission must be paid attention to. Therefore, when we design a flexible board, the distribution and routing of high-speed signal pads are very important. Appears to be particu...

AI Technical Summary

Problems solved by technology

The high-speed signal pads on the existing flexible board circuit are designed in a row. Due to the concentrated stress at the soldering point, the line of the high-speed signal pad is easy to break, and the corresponding high-speed signal line of the motherboard is difficult to achieve equal length, reducing signal integrity

[0003] And because the flexibility of multi-layer boards is much lower than that of single-layer boards, in the multi-process production and testing of optoelectronic devices and modules, repeated positioning and assembly will cause damage to flexible boards, which not only affects appearance, but also affects performance, leading to the use of flexible boards. Board products must be replaced with new flexible boards at high temperatures before they are sold. During the high temperature replacement process, it is easy to cause damage to the product again and cause it to fail.

Due to the above defects in flexible boards with high-density pads and their press-fitting methods, optoelectronic devices and communication modules are damaged or fail during the manufacturing and testing process, and the defect rate increases

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