Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing insulating layer and multilayer printed circuit board

A technology for insulating layers and circuit boards, which is applied to printed circuits, printed circuit manufacturing, and printed circuit components. It can solve problems such as easy cracking of insulating layers and difficulty in matching thicknesses, and achieve easy adjustment, prevention of physical damage, and simple manufacturing. Effect

Active Publication Date: 2021-04-30
LG CHEM LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The limitation is that the insulating layer is prone to cracking during physical removal and it is difficult to easily match the desired thickness

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing insulating layer and multilayer printed circuit board
  • Method for manufacturing insulating layer and multilayer printed circuit board
  • Method for manufacturing insulating layer and multilayer printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0170] (1) Manufacture of insulating layer

[0171] Polymerization obtained by mixing 16 g of the alkali-soluble resin synthesized in Production Example 1, 5 g of MY-510 (manufactured by Huntsman) as a heat-curable binder, and 35 g of SC2050 MTO (manufactured by Adamatech) as an inorganic filler The polymer resin composition was coated on an untreated PET film with a thickness of 25 μm and dried to prepare a polymer resin layer with a thickness of 18 μm.

[0172] Then, a dry film (RY-5319, Hitachi Kasei) was laminated on a copper foil laminate (LG-500GAVB / VB, LG Chem.) with a carrier copper foil attached to form a pattern, and electroplating was performed by the MSAP method to form a circuit. After that, a dry film (RY-5319, Hitachi Kasei) was laminated on the above circuit to be patterned, and electroplating was performed to form copper bumps with a height of 15 μm and a diameter of 20 μm.

[0173] Subsequently, a polymer resin layer was vacuum-laminated at 85° C. on the co...

Embodiment 2

[0178] An insulating layer and a multilayer printed circuit board were manufactured in the same manner as in Example 1, except that the alkali-soluble resin synthesized in Production Example 2 was used instead of the alkali-soluble resin synthesized in Production Example 1 in the manufacturing method of the insulating layer in Example 1. Alkali-soluble resins synthesized in

Embodiment 3

[0180] An insulating layer and a multilayer printed circuit board were manufactured in the same manner as in Example 1, except that the alkali-soluble resin synthesized in Production Example 3 was used instead of the alkali-soluble resin synthesized in Production Example 1 in the manufacturing method of the insulating layer in Example 1. Alkali-soluble resins synthesized in

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The present invention relates to a method for manufacturing an insulating layer, which can be manufactured in a faster and simpler manner, can improve process efficiency, can prevent physical damage to the insulating layer, and can easily adjust the layer thickness; and using the The method of manufacturing the insulating layer The obtained insulating layer is used as a method of manufacturing a multilayer printed circuit board.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2016-0138673 filed on October 24, 2016 and Korean Patent Application No. 10-2017-0136513 filed on October 20, 2017 and interests, the disclosure of which is incorporated herein by reference in its entirety. [0003] The invention relates to a method for producing an insulating layer and a method for producing a multilayer printed circuit board. More particularly, the present invention relates to a method for manufacturing an insulating layer, which can be manufactured in a faster and simpler manner, can improve process efficiency, can prevent physical damage to the insulating layer, and can easily adjust the layer thickness; and A method of manufacturing a multilayer printed circuit board using the insulating layer obtained by the method of manufacturing the insulating layer. Background technique [0004] Recent electronic device...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/03C08L79/08C08K3/00
CPCC08L79/085C08K3/013H05K1/0313H05K1/0353H05K1/0373H05K3/4647H05K3/467
Inventor 郑遇载庆有真崔炳柱崔宝允李光珠郑珉寿
Owner LG CHEM LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com