Circuit Board Thermal Simulation Components
A technology for circuit boards and printed circuit boards, which can be used in electronic circuit testing, measuring electricity, measuring electrical variables, etc., and can solve problems such as low data reliability.
Active Publication Date: 2021-07-27
CRRC DALIAN R & D CO LTD
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Problems solved by technology
[0005] The embodiment of the present invention provides a circuit board heat dissipation simulation component to overcome the problem that the simulated data needs to be selected according to experience and the data reliability is low
Method used
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Embodiment Construction
[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, those skilled in the art have obtained it without making creative efforts.
[0049] figure 1 A schematic structural diagram of a circuit board heat dissipation simulation component provided by an embodiment of the present invention. Such as figure 1 As shown, the assembly includes: a frame 10, a front panel 20, a rear panel 30 and a base 40, wherein
[0050] One end of the frame 10 is connected to the base 40, and the other end is provided with an air outlet 11;
[0051] The first side wall 12 of ...
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An embodiment of the present invention provides a circuit board heat dissipation simulation assembly, including: a frame, a front panel, a rear panel and a base, one end of the frame is connected to the base, and an air outlet is provided on the other end; the first side wall of the frame is provided with a second An opening, a second opening is provided on the second side wall of the frame, the first side wall is opposite to the second side wall to form an accommodation space for accommodating the printed circuit board; the front panel and the first side wall are detachable connected, and the front panel can be covered on the first opening, and the front panel is provided with a temperature measuring hole corresponding to the heating device on the front of the printed circuit board; the rear panel is detachably connected to the second side wall, and the rear panel The second opening can be covered, and the rear panel is provided with a temperature measuring hole corresponding to the heating device on the back of the printed circuit board; a fan is provided in the base, and the fan is used to blow the generated wind out from the air outlet. This embodiment can realize physical simulation, and the data reliability is high.
Description
technical field [0001] The invention relates to the technical field of circuit simulation, in particular to a circuit board heat dissipation simulation component. Background technique [0002] With the development of semiconductor technology, the integration of circuits is getting higher and higher, and the volume of electronic equipment is getting smaller and smaller, but the power consumption has increased. Therefore, in the design stage of electronic equipment, using heat dissipation simulation tools to simulate product heat dissipation, reduce failure rate, and improve product reliability has become the focus of electronic product design. [0003] In the prior art, the heat dissipation simulation tool adopts simulation software such as ANSYS and SolidWorks, which can simulate the heat radiation, heat conduction, heat convection, fluid temperature, fluid velocity and motion vector of the printed circuit board in the three-dimensional structure model, and can also simulate...
Claims
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IPC IPC(8): G01R31/28
CPCG01R31/2806G01R31/2817
Inventor 马志明李杉杉张立斌席赫
Owner CRRC DALIAN R & D CO LTD