Microelectromechanical sensor

Abstract

The invention discloses a microelectromechanical sensor, comprising: a substrate; An insulating structure formed on the substrate, wherein the insulating structure comprises an anchor structure and aplurality of projections, the projections being located on both sides of the anchor structure; A micro-electromechanical element joined to the protrusions on the substrate by the anchor structure, wherein the micro-electromechanical element comprises a center structure, a plurality of first structures, a plurality of sensing electrodes, a mass block, and a plurality of comb structures; An upper cover is arranged on that MEMS element for protect the MEMS element.

Description

technical field [0001] The present invention relates to a micro-electromechanical sensor, in particular to an element architecture design that can improve bonding effect and alignment accuracy, and increase electrical symmetry and etching uniformity to compensate for manufacturing process limitations. Background technique [0002] A general microelectromechanical systems (MEMS) sensor is composed of an upper cover, MEMS elements and a substrate. The resolution of the sensor is determined by the size of the output value of the capacitance change. The displacement of the MEMS component structure due to external force is the source of the capacitance change. [0003] At present, methods commonly used to improve component performance include: increasing the uniformity of ion beam distribution in the manufacturing process to avoid uneven component structure, resulting in variable component performance, but there are still limitations on the machine, for example, manufacturing T...

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Problems solved by technology

[0003] At present, methods commonly used to improve component performance include: increasing the uniformity of ion beam distribution in the manufacturing process to avoid uneven component structure, resulting in variable component performance, but there are still limitations on the machine, for example, manufacturing The window of the process range is too small, etc.

In addition, the capacitive area of ​​the element can also be increased. However, to increase the capacitive area on the MEMS element, it is necessary to increase the aspect ratio and increase the number and length of the comb structure (Comb). However, the increase of these items will increase the production capacity. Craft difficulty

The above two methods of improving the performance of MEMS components are all attempts to achieve it by improving the manufacturing process capability. However, both of them have certain restrictions.

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