High-contrast COB packaged small-pitch LED display panel

A high-contrast, display panel technology, used in identification devices, instruments, electrical components, etc., can solve the problem that the brightness of LED light-emitting chips is not high, the contrast of small-pitch products cannot be larger, and the area of ​​bonding pads cannot be very large. Small and other problems, to achieve the effect of reducing the design area of ​​the pad, improving the brightness, and preventing the flow area from being too large

Inactive Publication Date: 2019-01-18
CHANGCHUN CEDAR ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is limited because the COB package must consider the bonding pad and the bonding pad, and because the bonding area is too large, the bonding pad area cannot be made ver

Method used

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  • High-contrast COB packaged small-pitch LED display panel
  • High-contrast COB packaged small-pitch LED display panel
  • High-contrast COB packaged small-pitch LED display panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as Figure 2a As shown, the red LED light-emitting chip 501 adopts a vertical die-bonding structure, which requires wire bonding, while the green LED light-emitting chip 502 and blue LED light-emitting chip 503 adopt a flip-chip die-bonding structure, which does not require wire bonding, effectively saving pads Design area, reduce wire bonding area, improve contrast. The encapsulation adhesive layer 102 is blended with melanin with a total weight of 1‰ of the epoxy resin to further improve the contrast.

Embodiment 2

[0028] Such as Figure 2b As shown, the red LED light-emitting chip 501 and the blue LED light-emitting chip 503 adopt a vertical die-bonding structure, which requires wire bonding; the green LED light-emitting chip 502 adopts a flip-chip die-bonding structure, which does not require wire bonding, effectively saving pads Design area, reduce wire bonding area, improve contrast. The encapsulation adhesive layer 102 is blended with melanin with a total weight of 4‰ of the epoxy resin to further improve the contrast.

Embodiment 3

[0030] Such as Figure 2c As shown, the red LED light-emitting chip 501 and the green LED light-emitting chip 502 adopt a vertical die-bonding structure, which requires wire bonding; the blue LED light-emitting chip 503 adopts a flip-chip die-bonding structure, which does not require wire bonding, effectively saving pads Design area, reduce wire bonding area, improve contrast. The encapsulation adhesive layer 102 is blended with melanin with a total weight of 1‰ of the epoxy resin to further improve the contrast.

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Abstract

The invention relates to a high-contrast COB packaged small-pitch LED display panel, comprising a driving circuit board, an encapsulating adhesive layer, a pixel unit and a driving IC. Each pixel unitcomprises a red, green and blue LED light emitting chip, and at least one LED light emitting chip of the primary color adopts a flip-chip LED light emitting chip. The encapsulant layer is made of epoxy resin, and its thickness is 0.4-0.65 mm, and wherein the melanin is mixed with 0.1 % to 0.6% of the total weight of the epoxy resin; At least one primary color LED light emit chip of that inventionadopts a flip-chip LED light emit chip, which not only reduces the design area of the bonding pad, reduces the bonding wire area of the light emit chip, but also improves the brightness of the display screen; At that same time, the contrast of the display screen can be effectively improve due to the addition of melanin in the encapsulation adhesive layer.

Description

technical field [0001] The invention belongs to the technical field of LED display screens, and relates to a high-contrast COB packaged small-pitch LED display panel. Background technique [0002] With the development of small-pitch COB packaging technology, COB small-pitch packaging products have gradually become a hot spot. The main reason is that compared with the current mainstream surface-mount technology, COB small-pitch integrated packaging can achieve a smaller point pitch. [0003] The technical advantages of COB small-pitch products mainly include two points: first, the adhesive layer on the surface of COB small-pitch products is more conducive to protecting the light-emitting surface; The field of small spacing has natural technical advantages. The technical route of COB integrated small-pitch packaging is to place the chip directly on the PCB, and connect the positive and negative electrodes of the chip to the PCB through a wire bonding machine. In order to pro...

Claims

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Application Information

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IPC IPC(8): G09F9/33H01L25/075H01L33/56H01L33/62
CPCG09F9/33H01L25/0753H01L33/56H01L33/62
Inventor 马新峰段健楠王瑞光韩悦
Owner CHANGCHUN CEDAR ELECTRONICS TECH CO LTD
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