High-contrast COB packaged small-pitch LED display panel

Abstract

The invention relates to a high-contrast COB packaged small-pitch LED display panel, comprising a driving circuit board, an encapsulating adhesive layer, a pixel unit and a driving IC. Each pixel unitcomprises a red, green and blue LED light emitting chip, and at least one LED light emitting chip of the primary color adopts a flip-chip LED light emitting chip. The encapsulant layer is made of epoxy resin, and its thickness is 0.4-0.65 mm, and wherein the melanin is mixed with 0.1 % to 0.6% of the total weight of the epoxy resin; At least one primary color LED light emit chip of that inventionadopts a flip-chip LED light emit chip, which not only reduces the design area of the bonding pad, reduces the bonding wire area of the light emit chip, but also improves the brightness of the display screen; At that same time, the contrast of the display screen can be effectively improve due to the addition of melanin in the encapsulation adhesive layer.

Description

technical field [0001] The invention belongs to the technical field of LED display screens, and relates to a high-contrast COB packaged small-pitch LED display panel. Background technique [0002] With the development of small-pitch COB packaging technology, COB small-pitch packaging products have gradually become a hot spot. The main reason is that compared with the current mainstream surface-mount technology, COB small-pitch integrated packaging can achieve a smaller point pitch. [0003] The technical advantages of COB small-pitch products mainly include two points: first, the adhesive layer on the surface of COB small-pitch products is more conducive to protecting the light-emitting surface; The field of small spacing has natural technical advantages. The technical route of COB integrated small-pitch packaging is to place the chip directly on the PCB, and connect the positive and negative electrodes of the chip to the PCB through a wire bonding machine. In order to pro...

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Problems solved by technology

However, it is limited because the COB package must consider the bonding pad and the bonding pad, and because the bonding area is too large, the bonding pad area cannot be made very small, and the brightness of the vertically packaged LED light-emitting chip is not high. Several reasons lead to the COB packaging small-pitch product contrast cannot be greater

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