Wafer lifting device for process chamber of semiconductor equipment

Abstract

The invention discloses a wafer lifting device of a process cavity of a semiconductor device, which is arranged at the bottom of the process cavity of the semiconductor device and extends into the process cavity of the semiconductor device. The lifting device comprises a lifting tube arranged at the bottom of the process cavity of the semiconductor device and extends into the process cavity of thesemiconductor device. A lifting block is arranged inside the lifting tube, and a thimble is arranged at the top of the lifting block; The lifting block moves up and down inside the lifting tube and drives the thimble to move up and down and realizes the lifting control of the wafer. The width of the lifting block is smaller than the diameter of the lifting pipe, and a cushioning device is arranged between the side surface of the lifting block and the inner side surface of the lifting pipe, which prevents the side surface of the lifting block from directly contacting with the inner side surface of the lifting pipe and reduces the frictional force generated when the lifting block and the inner side surface of the lifting pipe collide. The invention can reduce the frictional force generatedin the up and down moving process of the wafer lifting device, thereby avoiding and reducing the metal precipitation generated by the friction, and improving the yield of the product and the service life of the component.

Description

technical field [0001] The invention relates to equipment for manufacturing semiconductor integrated circuits, in particular to a wafer lifting device for a process chamber of a semiconductor equipment. Background technique [0002] In the field of semiconductor integrated circuit manufacturing, integrated circuits are usually fabricated on wafers, and the fabrication of a complete chip requires multiple steps. During each process step, the wafer needs to be placed in the process chamber of the corresponding semiconductor equipment. The placement of the wafer is carried out automatically, and the wafer lifting device needs to be used in the process of automatic wafer pick-up and placement. , The wafer in the process chamber is raised and lowered by the wafer lifting device, which is convenient for the pick-and-place of the manipulator. Such as figure 1 As shown, it is the wafer lifting device of the existing semiconductor equipment process chamber. The semiconductor equipm...

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Problems solved by technology

[0013] figure 1 In the structure shown, during the up and down movement of the lifting block 102, the sides of the lifting block 102 will often have contact friction with the inner surface of the lifting tube 101, and the contact friction between the sides is relatively large. , easy to produce metal precipitation, which will affect the service life of equipment components and the precipitated metal will pollute the wafer products in the process chamber, resulting in poor chamber ICP-Ms and affecting product yield

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