A water-cooled head buckle structure

Abstract

A water-cooled head buckle structure which is arranged on a water-cooled head., and is connected with a motherboard provided with a heating element and attached to the water-cooling head, The water-cooled head fastener structure comprises a fastener, wherein the fastener has a hollow opening and a plurality of through holes arranged along a circumferential side of the fastener, the plurality of through holes are used for fixing a plurality of fasteners on the main board, and the opening of the fastener is sleeved on the water-cooled head, so that the water-cooled head receives the fastener; The fastener of the invention can adjust the position of the through hole of the heating element according to the manufacturer's brand and the specification type design of the heating element on the main board.

Description

technical field [0001] The invention relates to a buckle structure for a water-cooled head, in particular to a buckle structure for a water-cooled head that reduces costs and improves production efficiency. Background technique [0002] With the advancement of science and technology, the operating frequency of electronic products (such as computers, servers or communication chassis) is getting faster and faster, so that the heat generated during operation is also increasing, and the relative heat dissipation requirements are also increasing. Among them, servers For example, because the server is aimed at big data and cloud computing processing, the existing air cooling can no longer afford the heat dissipation of current electronic products such as central processing unit (CPU), graphics card chip (GPU), north-south bridge chip or ASIC chip Therefore, the industry has developed a water-cooled plate to meet the above heat dissipation requirements. [0003] The structural des...

AI Technical Summary

Problems solved by technology

[0004] The positions of the plurality of locking holes of the upper cover of the existing water-cooled plate and the plurality of locking holes of the lower cover are designed according to the specifications and models of the heating elements of the main board and the requirements of the manufacturer. , because heating elements of different specifications and models (such as central processing unit, graphics card chip (GPU), north-south bridge chip or ASIC chip) require water-cooling plates with different locking hole positions, such as CPUs of different specifications and models of the same brand (such as INTEL I3-CPU or INTEL I7-CPU) it is necessary to design a water-cooled plate with different locking hole positions (for example, the water-cooled plate corresponding to INTEL I3-CPU is designed with 4 locking holes in the four corners of the water-cooled plate or Corresponding design of water-cooling board for Intelli5-CPU (6 locking holes are set on the upper and lower sides of the water-cooling board), or CPUs of different brands (such as INTEL I7-CPU or AMD Ryzen7-CPU) also need corresponding design Another water-cooling board with different locking hole positions (for example, the water-cooling board corresponding to INTEL I7-CPU design 5

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