A water-cooled head buckle structure

A water-cooled head and buckle technology, applied to instruments, electrical digital data processing, electrical components, etc., can solve problems such as high R&D costs, inability to uniformly control risks, and inability to achieve mass production, and achieve the effect of saving R&D costs

Pending Publication Date: 2019-01-18
ASIA VITAL COMPONENTS (CHINA) CO LTD
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Problems solved by technology

[0004] The positions of the plurality of locking holes of the upper cover of the existing water-cooled plate and the plurality of locking holes of the lower cover are designed according to the specifications and models of the heating elements of the main board and the requirements of the manufacturer. , because heating elements of different specifications and models (such as central processing unit, graphics card chip (GPU), north-south bridge chip or ASIC chip) require water-cooling plates with different locking hole positions, such as CPUs of different specifications and models of the same brand (such as INTEL I3-CPU or INTEL I7-CPU) it is necessary to design a water-cooled plate with different locking hole positions (for example, the water-cooled plate corresponding to INTEL I3-CPU is designed with 4 locking holes in the four corners of the water-cooled plate or Corresponding design of water-cooling board for Intelli5-CPU (6 locking holes are set on the upper and lower sides of the water-cooling board), or CPUs of different brands (such as INTEL I7-CPU or AMD Ryzen7-CPU) also need corresponding design Another water-cooling board with different locking hole positions (for example, the water-cooling board corresponding to INTEL I7-CPU design 5

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  • A water-cooled head buckle structure
  • A water-cooled head buckle structure
  • A water-cooled head buckle structure

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[0041] The above objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

[0042] The present invention is a water-cooled head buckle structure, please refer to Figure 1A It is a three-dimensional exploded schematic diagram of the first embodiment of the present invention; Figure 1B It is a perspective exploded schematic diagram of another perspective of the first embodiment of the present invention; Figure 2A It is a three-dimensional combined schematic diagram of the first embodiment of the present invention; Figure 2B It is a partial cross-sectional schematic diagram of the three-dimensional combination according to the first embodiment of the present invention; Figure 3A It is an exploded schematic diagram of the implementation aspect of the first embodiment of the present invention; Figure 3B It is a schematic diagram of the combination of the i...

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Abstract

A water-cooled head buckle structure which is arranged on a water-cooled head., and is connected with a motherboard provided with a heating element and attached to the water-cooling head, The water-cooled head fastener structure comprises a fastener, wherein the fastener has a hollow opening and a plurality of through holes arranged along a circumferential side of the fastener, the plurality of through holes are used for fixing a plurality of fasteners on the main board, and the opening of the fastener is sleeved on the water-cooled head, so that the water-cooled head receives the fastener; The fastener of the invention can adjust the position of the through hole of the heating element according to the manufacturer's brand and the specification type design of the heating element on the main board.

Description

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Claims

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Application Information

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Owner ASIA VITAL COMPONENTS (CHINA) CO LTD
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