3D stereoscopic package structure and package method of I/F conversion system

A three-dimensional, packaging structure technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of poor versatility, large volume, heavy weight, etc., to reduce weight, increase wiring area, and improve finished products The effect of rate and manufacturability

Pending Publication Date: 2019-01-22
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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Problems solved by technology

[0003] A three-dimensional packaging structure and packaging method for an I/F conversion system proposed by the pr

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  • 3D stereoscopic package structure and package method of I/F conversion system
  • 3D stereoscopic package structure and package method of I/F conversion system
  • 3D stereoscopic package structure and package method of I/F conversion system

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Embodiment Construction

[0031] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments.

[0032] Such as figure 1 , figure 2 As shown, the three-dimensional package structure of the I / F conversion system in this embodiment includes an LTCC double-sided board 1 and an HTCC integrated package body, wherein the LTCC double-sided board 1 is a multilayer metalized Al 2 O 3 For ceramic substrates, the top surface 6 and bottom surface 7 of the ceramic substrate are lithographically or screen-printed with multilayer metallization patterns to facilitate electrical connection; the HTCC integrated package body includes AlN multilayer cer...

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Abstract

A 3-D stereoscopic package structure and a package method of an I/F conversion system can solve that technical problem that the prior art is large in volume and heavy in weight, and cannot be appliedto the field of high precision. The structure comprises an LTCC double panel and an HTCC package main body, wherein the HTCC package main body comprises a ceramic cavity, a metal ring frame, an outerlead and a cover plate, wherein the metal ring frame is arranged on the top of the ceramic cavity, and the cover plate is arranged on the metal ring frame; The LTCC double panel is horizontally arranged inside the ceramic cavity, the LTCC double panel is a multi-layer metallized ceramic substrate, metallized pads are respectively arranged on both sides of the LTCC double panel and the inner bottomsurface of the ceramic cavity, and the outer leads are horizontally arranged on the outer side surface of the ceramic cavity bottom plate. The invention realizes the three-dimensional integration ofthe system by adopting the stacking structure of the double-panel and the AlN integrated packaging main body and the vertical interconnection technology. The invention has strong universality and canbe widely applied to the integration of the high-precision, high-reliability and miniaturization inertial navigation system.

Description

Technical field [0001] The invention relates to the technical field of three-dimensional integrated circuit applications, in particular to a three-dimensional packaging structure and packaging method of an I / F conversion system. Background technique [0002] With the increasing demands of inertial navigation systems for miniaturization, light weight, high precision, and high reliability, the integration of high-precision and miniaturized I / F conversion systems has become the focus of research in the field of inertial navigation in recent years. At present, the domestic high-precision and high-reliability I / F conversion system mainly uses traditional metal packaging technology to achieve system integration on a two-dimensional plane, which is relatively large and heavy, and cannot meet future development requirements; while monolithic integrated I / F conversion The preparation process of the system is difficult and the accuracy is low, and it is currently unable to meet the applica...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/15H01L21/52
CPCH01L21/52H01L23/15H01L23/49811H01L23/49822H01L23/49838H01L23/49861
Inventor 孙函子刘全威张崎尚玉凤王宁张柯庄永河
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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