Resin composition and prepared prepreg thereof, laminated board

A technology of resin composition and prepreg, which is applied in the fields of prepreg and laminate, can solve problems such as the inability to meet the high-frequency and high-speed requirements of electronic circuit substrates, and meet the needs of high-speed and high-frequency use. Effect of high machinability and glass transition temperature

Active Publication Date: 2019-01-25
同宇新材料(广东)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One of the objectives of the present invention is to provide a resin composition to alleviate the technical pr

Method used

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  • Resin composition and prepared prepreg thereof, laminated board
  • Resin composition and prepared prepreg thereof, laminated board
  • Resin composition and prepared prepreg thereof, laminated board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0092] In a preferred embodiment of the present invention, the preparation method of the prepreg comprises the following steps: impregnating the base material in the glue liquid made of the resin composition, and then placing the base material impregnated with the glue liquid in an oven to heat After drying, the prepreg can be obtained.

[0093] According to the third aspect of the present invention, the present invention provides a laminate including at least one prepreg provided by the present invention.

[0094] The laminate provided by the present invention is prepared by using the resin composition provided by the present invention, which not only has good mechanical processing performance, but also has low dielectric loss, high glass transition temperature, and UV-blocking function, which can meet the requirements of PCB The use of high-speed and high-frequency substrate materials.

[0095] According to the fourth aspect of the present invention, the present invention provides...

Example Embodiment

[0129] Example 9

[0130] This embodiment provides a resin composition. The difference between this embodiment and Embodiment 8 is that the active ester curing agent has the following structure:

[0131]

[0132] Where R 1 , R 2 , R 3 And R 4 All are ethyl.

Example Embodiment

[0133] Example 10

[0134] This embodiment provides a resin composition. The difference between this embodiment and Embodiment 8 is that the active ester curing agent has the following structure:

[0135]

[0136] Where R 1 , R 2 , R 3 And R 4 All are allyl.

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Abstract

The invention provides a resin composition and a prepared prepreg thereof, a laminated board, and relates to the technical field of high molecular materials. The resin composition is prepared from 10-90 parts of epoxy resin and 1-50 parts of an active ester curing agent. A technical problem that current resin cannot meet high-frequency high-speed requirements of an electronic circuit base materialis relieved. The provided resin composition is capable of using the epoxy resin as main body resin, so the resin composition has a good machining property. A micromolecular substance with a naphthalene ring and a polyfunctionality ester bond structure is used as the active ester curing agent, so the cured resin composition is low in dielectric loss, high in vitrification transfer temperature, andhas a UV-blocking function at the same time, is capable of meeting high-speed and high-frequency using requirements of a base board material for a PCB.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition and a prepreg and a laminate made thereof. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of communication equipment such as computers and mobile phones, in order to transmit and process large-capacity information at high speed, operating signals are becoming high-frequency. At the same time, with the continuous improvement of human life Technology and high informatization, information processing and information communication have become an important part of human life. Human beings are constantly pursuing high-speed information processing, high integrity of audio-visual transmission, miniaturization and multi-functionalization of scientific and technological electronic products, etc. New technologies represented by large-scale network workstations, mobile phone wireless comm...

Claims

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Application Information

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IPC IPC(8): C08G59/42C08J5/24C08L61/34C08L63/00C08L63/04C08K13/02C08K7/18C08K5/06B32B15/14B32B5/02B32B33/00B32B27/04B32B27/38B32B27/26
CPCB32B5/02B32B15/14B32B33/00B32B2260/021B32B2260/046B32B2457/08C08G59/4223C08J5/24C08J2361/34C08J2363/00C08J2461/34C08J2463/00C08J2463/04C08K5/06C08K7/18C08K13/02
Inventor 苏世国张驰章星邓凯华胡展东
Owner 同宇新材料(广东)股份有限公司
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