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Dynamic high-flux measurement device for measuring bending and compression performances of microstructure of material

A material microscopic and measuring device technology, used in measuring devices, analyzing materials, and material analysis by optical means, etc., can solve the problems of unobservable microstructure changes, low accuracy, and meshing accuracy affecting simulation results.

Pending Publication Date: 2019-01-29
KUNMING UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the current metallographic microanalysis technology is limited to the static observation of the sample, qualitatively describes the microstructure characteristics of metal materials or evaluates the microstructure, grain size, non-metallic inclusions and the second by comparing with various standard pictures. Phase particles, etc., this method is not very accurate, and the evaluation is highly subjective, and the samples under working conditions can only be sampled and analyzed afterwards, and the microstructural changes in the process cannot be observed
The traditional research method is to establish a finite element simulation model with the initial state and final state as the boundary conditions for different deformation characteristics, so as to study the plastic deformation mechanism of material grains. The accuracy of mesh division greatly affects the simulation results, and often cannot reflect the real Deformation

Method used

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  • Dynamic high-flux measurement device for measuring bending and compression performances of microstructure of material
  • Dynamic high-flux measurement device for measuring bending and compression performances of microstructure of material
  • Dynamic high-flux measurement device for measuring bending and compression performances of microstructure of material

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Embodiment 1

[0056]A dynamic high-throughput measurement device for bending and compressing properties of material microstructures, including a power switch 1, a touch control panel 2, a housing 3, a front observation window 4, a rear observation window 5, a front cover 7, a color filter 8, and an aperture diaphragm 9. Microscope light source 10, camera interface 12, rear guide rail 13, front guide rail 14, computer data interface 16, atmosphere input terminal 17, atmosphere output terminal 18, servo motor 26, reducer 27, left bracket 28, front slide bar 29, Slider 30, slider front sliding bearing 31, pressure head 32, pressure head front sliding bearing 33, displacement sensor 34, screw rod 36, slider rear sliding bearing 37, nut 38, support rod 39, rear sliding rod 40, pressure sensor Left support frame 41, pressure sensor 42, pressure sensor right support frame 43, rear sliding bearing 45 of pressure head, rear support seat 46, rear insulating sheet 47, front supporting seat 50, front in...

Embodiment ２

[0064] The structure of this embodiment is the same as that of Embodiment 1, except that the compression head 54 is replaced by a front curved support roller 62 and a rear curved support roller 58, the compression support platform 56 is replaced by a curved support platform 59, and the front curved support roller 62 is fixed on On the front insulating sheet 51, the rear bending support roller 58 is fixed on the rear insulating sheet 47, the left end of the bending support platform 59 is an arc-shaped structure, and the bending support platform 59 is fixed on the right bracket 52 through the dovetail groove; the three-point bending sample 63 Installed between the front bending support roller 62, the rear bending support roller 58 and the bending support table 59, the three-point bending sample metallographic observation area 60 is prepared on the upper end surface of the three-point bending sample 63, the objective lens 25 is focused on the metallographic observation, and the tem...

Embodiment ３

[0067] The structure of this embodiment is the same as that of Embodiment 1, the difference is that the compression indenter 54 is replaced by a V-shaped bending indenter 64, the compression support platform 56 is replaced by a V-shaped bending support platform 67, and the left end of the V-shaped bending support platform 67 is V V-shaped bending indenter 64 is fixed on the front insulating sheet 51 and rear insulating sheet 47, the V-shaped bending support table 67 is fixed on the right bracket 52 through the dovetail groove, and the V-shaped bending sample 65 is installed on the V-shaped bending indenter Between 64 and the V-shaped bending support platform 67 , the V-shaped curved metallographic observation area 66 is prepared from the V-shaped curved sample 65 , and the objective lens 25 is focused on the V-shaped curved metallographic observation area 66 .

[0068] The experimental material is ZCuPb30, the sample length is 30mm, the width is 8mm, and the thickness is 3mm. T...

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Abstract

The invention discloses a dynamic high-flux measurement device for measuring the bending and compression performances of the microstructure of a material, and belongs to the field of material metallographic analysis and mechanical performance testing. The device in the invention comprises a base, a stretching device, a microscopic test system, a low-temperature test system, a high-temperature testsystem and a stretching bracket; the stretching device is installed on the stretching bracket; the microscopic test system is just over a sample; and a control computer is connected with an upper computer through a data interface. According to the dynamic high-flux measurement device in the invention, the microstructure change rule of the material in the deformation process in all kinds of atmosphere and temperature environments can be continuously observed; simultaneously, the stress-strain curve of the sample and the metallographic structure corresponding to each point on the curve in all kinds of atmosphere and temperature environments are obtained; and, due to observation and analysis on the microstructure deformation and fracture mechanism of the material, mechanical property influence factors on intracrystalline, crystal boundary, twin crystals, dislocation, the second phase and the like are observed and researched.

Description

technical field [0001] The invention relates to a dynamic high-throughput measuring device for bending and compressing performance of material microstructure, which belongs to the field of material metallographic analysis and mechanical performance testing. Background technique [0002] Metallographic microanalysis is to study the microstructure of metals and alloys, including grains, inclusions and phase transformation products, through metallographic microscopes. Metallographic microanalysis is one of the important means of metal material product quality inspection and metal material test research. Metallographic analysis can determine the appearance of the product and judge the microstructure of the workpiece after heat treatment. Metallographic microanalysis is an important basic means of material analysis. Through metallographic analysis Phase analysis is a method to obtain the size, shape, distribution, quantity and properties of metal and alloy structures, and at the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/20G01N21/84
CPCG01N3/20G01N21/84
Inventor 傅强胡劲段云彪
Owner KUNMING UNIV OF SCI & TECH
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