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Electronic chip packaging shell and manufacturing method thereof

A technology for encapsulating shells and electronic chips, which is applied in transformer/inductor shells, inductance/transformer/magnet manufacturing, coil manufacturing, etc., can solve problems such as low work efficiency and long winding time, and achieve fixed efficiency improvement and high efficiency. high effect

Pending Publication Date: 2019-02-01
DEYANG ZHIDA PRECISION ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a manufacturing method of an electronic chip packaging shell to solve the above-mentioned technical problems of long winding time and low work efficiency during the coil welding process of the electronic chip packaging shell

Method used

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  • Electronic chip packaging shell and manufacturing method thereof
  • Electronic chip packaging shell and manufacturing method thereof
  • Electronic chip packaging shell and manufacturing method thereof

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Embodiment Construction

[0034] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0035] The front schematic diagram of the first embodiment of the electronic chip packaging shell of the present invention is shown in figure 1 ,

[0036] An electronic chip packaging shell, used for placing and welding coils, including a shell body 01 and a PIN pin 02, the top of the shell body 01 is in the shape of an open box, the shell body 01 includes a shell side wall 011, and the PIN pin 02 passes through the shell side The wall 011 extends from the bottom of the housing main body 01 to the opening of the housing main body 01, and the PIN pin 02 forms a welding wire terminal at the opening; the welding wire terminal extends in a direction perpendicular to the outer surface of the housing side wall 011 to form a PIN pin extension End 03, the extension end 03 of the PIN pin is provided with a notch structure 031, and the width of the narrowest ope...

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Abstract

The invention relates to an electronic chip packaging shell which is used for containing and welding a coil. The electronic chip packaging shell comprises a shell main body made from thermosetting flame retardant materials and PINs, the top of the shell main body is shaped like an open box and comprises a shell side wall, the PINs penetrate through the shell side wall, and the PIN located at the opening is a welding line terminal; the welding line terminal extends to the side face of the shell main body to form a PIN extension end, the PIN extension end is provided with a notch structure, andthe width of the narrowest portion of an opening of the notch structure is smaller than the diameter of a lead terminal of the coil. Due to the fact that the width of the narrowest portion of the opening of the notch structure is smaller than the diameter of the lead terminal of the coil, the lead terminal is clamped in the notch structure of the PIN extension end very stably without moving, the efficiency is very high, and compared with the method that the lead terminal is wound around the PIN extension end, the fixing efficiency of the lead terminal is improved by at least ten times.

Description

technical field [0001] The invention relates to the technical field of electronic chip packaging shells, in particular to an electronic chip packaging shell and a manufacturing method thereof. Background technique [0002] In the existing electronic chip packaging shell, the coil is placed in the shell, and the lead terminal of the coil needs to be wound around the end of the PIN pin of the transformer shell, so that the lead terminal is fixed, and then the lead wire of the coil is welded on the PIN pin. The fixing method of the lead terminal takes a long time to wind the wire during the welding process of the coil, and the working efficiency is low. Contents of the invention [0003] The present invention provides a method for manufacturing an electronic chip packaging shell to solve the above-mentioned technical problems of long winding time and low work efficiency during the coil welding process of the electronic chip packaging shell. [0004] In order to solve the abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/29H01F27/28H01F27/02H01F41/10H01F41/00
CPCH01F27/022H01F27/28H01F27/29H01F41/005H01F41/10
Inventor 杜效白阳东旭
Owner DEYANG ZHIDA PRECISION ELECTRONICS