BGA (Ball Grid Array) test socket adopting flexible connection

A test socket and flexible connection technology, which is applied in the field of BGA test sockets with flexible connections, can solve problems such as BGA ball damage, achieve the effect of reducing damage and realizing flexible connection

Inactive Publication Date: 2019-02-05
TIANJIN JINHANG COMP TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention proposes a BGA test socket with flexible connection to solve the technical problem of how to avoid the traditional BGA socket from causing damage to the BGA ball through a hard metal connection

Method used

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  • BGA (Ball Grid Array) test socket adopting flexible connection
  • BGA (Ball Grid Array) test socket adopting flexible connection

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Embodiment Construction

[0013] In order to make the purpose, content and advantages of the present invention clearer, the specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0014] This embodiment proposes a flexible connection BGA test socket, its structure is as follows figure 2 shown. The BGA test socket includes a first socket layer 1 , a second socket layer 2 , a third socket layer 3 , conductive silicone rubber 4 , conductive springs 5 ​​, metal pillars 6 and BGA balls 7 . Wherein, the first socket layer 1, the second socket layer 2, and the third socket layer 3 are stacked together from top to bottom, and pressed together by bolts around them to form a composite socket layer. Through holes are formed in the composite socket layer, wherein the size of the second through hole in the second socket layer 2 is larger than the first through hole in the first socket layer 1 and the third ...

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Abstract

The invention belongs to the technical field of BGA (Ball Grid Array) packaging, and in particular relates to a BGA test socket adopting flexible connection. A part in contact with a BGA ball in the test socket is replaced by a conductive silicone rubber with high conductivity so as to implement flexible support for the BGA ball; and flexible connection inside the test socket is implemented by useof a conductive spring. With the BGA test socket adopting flexible connection, the flexible connection between a BGA chip and a test PCB (Printed Circuit Board) can be implemented, and the damage tothe BGA ball in a BGA chip test process is reduced.

Description

technical field [0001] The invention belongs to the technical field of BGA packaging, and in particular relates to a flexible-connected BGA test socket. Background technique [0002] The traditional BGA test socket is to put the chip into the slot of the socket, and the BGA ball under the chip realizes the connection between the chip BGA ball and the PCB board through the hard metal pin of the socket. The specific structure is as follows: figure 1 shown. When the chip is tested for aging and function screening for a long time, it will cause certain damage to the BGA ball, which will seriously affect the coplanarity of the BGA ball. [0003] Conductive silicone rubber is made of silicone rubber as the base rubber, adding conductive fillers, cross-linking agents, etc., and vulcanized. The commonly used base rubber is methyl vinyl silicone rubber, and the commonly used conductive fillers include acetylene carbon black, carbon fiber, superconducting carbon black, graphite, cop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2808
Inventor 候俊马朱天成张楠鲁毅
Owner TIANJIN JINHANG COMP TECH RES INST
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