Semi-solidified epoxy glue film as well as preparation method and use thereof

An epoxy film and semi-curing technology, which is applied in the direction of epoxy resin glue, adhesive, film/sheet adhesive, etc., can solve the problems of high cross-linking density, high brittleness, limited application, etc., and solve the problem of viscosity low effect

Active Publication Date: 2019-02-12
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high cross-linking density of epoxy resin itself leads to its inherent brittleness, which limits its application in the field of low-temperature engineering, and low-temperature toughening modification is necessary.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] According to A component E51 resin: B component dicyandiamide curing agent: C component D230 curing agent mass ratio 100:8:5 to take materials. Add component B into component A epoxy, stir at 80°C for 30 minutes, and disperse evenly; then add component C, and react under vacuum at 70°C for 10 minutes. Put the resin on the film coating machine and coat the film at 80°C to obtain a semi-cured low-temperature adhesive film

[0043] Grind the bonding interface; lay low-temperature adhesive film on the bonding surface, and butt the bonding parts; cover the bonding parts with a vacuum bag, heat and pressurize the autoclave to form the bonding parts, and the curing system : 120°C 0.5h+160°C 0.5h, curing pressure 0.2MPa.

[0044] The obtained adhesive joints were tested according to GB / T 7124 and GB / T 1457. The test results are: the tensile shear strength of the adhesive film at room temperature is 27.72MPa, the tensile shear strength at -196°C is 23.59MPa, and the peel streng...

Embodiment 2

[0046] According to A component E51 resin: B component dicyandiamide curing agent: C component D230 curing agent mass ratio 100:7:6 to take materials. Add component B to component A epoxy, stir at 76°C for 25 minutes, and disperse evenly; then add component C, and react under vacuum at 55°C for 10 minutes. Put the resin on the film coating machine, and coat the film at a temperature of 75°C to obtain a semi-cured low-temperature adhesive film

[0047] Grind the bonding interface; lay low-temperature adhesive film on the bonding surface, and butt the bonding parts; cover the bonding parts with a vacuum bag, heat and pressurize the autoclave to form the bonding parts, and the curing system : 120°C 0.8h+155°C 0.8h, curing pressure 0.2MPa.

[0048] The obtained adhesive joints were tested according to GB / T 7124 and GB / T 1457. The test results are: the tensile shear strength of the adhesive film at room temperature is 30.21MPa, the tensile shear strength at -196°C is 25.56MPa, and...

Embodiment 3

[0050] According to A component E51 resin: B component dicyandiamide curing agent: C component D230 curing agent mass ratio 100:12:2 to take the material. Add component B to component A epoxy, stir at 90°C for 60 minutes, and disperse evenly; then add component C, and react under vacuum at 70°C for 30 minutes. Put the resin on the film coating machine and coat the film at 90°C to obtain a semi-cured low-temperature adhesive film

[0051] Grind the bonding interface; lay low-temperature adhesive film on the bonding surface, and butt the bonding parts; cover the bonding parts with a vacuum bag, heat and pressurize the autoclave to form the bonding parts, and the curing system : 130℃1h+170℃0.5h, curing pressure 0.3MPa.

[0052] The obtained adhesive joints were tested according to GB / T 7124 and GB / T 1457. The test results are: the tensile shear strength of the adhesive film at room temperature is 28.15MPa, the tensile shear strength at -196°C is 24.09MPa, and the peel strength o...

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Abstract

The invention relates to a semi-solidified epoxy glue film as well as a preparation method and use thereof, in particular to a semi-solidified heat-fusion method low-temperature epoxy glue film and apreparation and use method thereof. Through a semi-solidifying method, a flexible chain section is added into an epoxy resin molecular chain, and a heat-fusion method is used for preparing the epoxy glue film which is suitable for being applied to a low-temperature environment, and a preparation and use method of the epoxy glue film. The low-temperature epoxy glue film is suitable for preparing asandwich structure and a glue joint structure under a the low-temperature environment. The semi-solidified epoxy glue film can be applied to the fields such as low-temperature wind tunnel blades, low-temperature composite material storage boxes and, low-temperature super-conduction, and the low-temperature is a temperature -150 DEG C or less.

Description

technical field [0001] The invention relates to a semi-cured epoxy adhesive film and its preparation method and use, in particular to a semi-cured hot-melt method low-temperature epoxy adhesive film and its preparation and use method. The flexible chain segment is prepared by a hot-melt method to prepare an epoxy adhesive film suitable for low-temperature environments and its preparation and use method. The low-temperature epoxy adhesive film is suitable for the preparation of sandwich structures and glued structures in low-temperature environments. It can be applied to low-temperature wind tunnel blades, low-temperature composite material storage tanks, low-temperature superconductivity and other fields, and the low temperature is below minus 150°C. Background technique [0002] In engineering applications, commonly used organic resin structural adhesives are mostly used at room temperature or at a certain high temperature (≤400°C). However, at low temperatures (<-150°...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J7/10C09J7/30
CPCC09J163/00C09J2463/00C09J7/10C09J7/30
Inventor 史汉桥雷琴何析峻杨昆晓孙宝岗张毅蒋文革
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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