A mobile phone temperature control device based on phase change capsule and bionic microfluidic channel

Abstract

The invention discloses a temperature controlling device for a mobile phone based on a phase change capsule and bionic micro-channels. The device comprises a mobile phone casing and a cooling plate, wherein the inner portion of the mobile phone casing is provided with a groove, and the cooling plate is placed in the groove of the mobile phone casing; and the cooling plate is provided with the bionic micro-channels, and the bionic micro-channels are provided with deionized cooling liquid as a circulating working medium. According to the temperature controlling device for the mobile phone basedon the phase change capsule and bionic micro-channels, a piping system of natural organisms is superior in terms of heat exchange and pressure loss. Heat can be quickly transferred into the radial flow path through a conductive cooling plate with high heat conductivity. Heat can be quickly transferred into the lower part of the housing, that is, the back of the cooling plate for cooling through the circulating working medium. Wicks distributed in cooling channels provide the power of the fluid circulation in the micro-channels through the capillary effect, ensuring that the heat can be quicklyexported to achieve effective cooling and temperature controlling for the mobile phone. Therefore, low energy consumption, compact, and high efficiency cooling of portable mobile electronic device can be achieved.

Description

technical field [0001] The invention belongs to the field of enhanced heat transfer, and in particular relates to a mobile phone temperature control device of a phase change capsule and a bionic micro-flow channel. Background technique [0002] With the development of the semiconductor industry and the Internet industry, portable computing devices represented by mobile phones occupy an increasingly important position in social life, and the heat dissipation of electronic devices has also become a current research focus. At present, the realization of the functions of electronic devices is mainly based on silicon-based chips, and the power consumed by them will eventually be dissipated into the environment in the form of heat, resulting in an increase in the ambient temperature. The high temperature environment will seriously damage the working performance of silicon-based chips and shorten their lifespan, which will lead to a huge waste of energy and resources. Therefore, t...

AI Technical Summary

Problems solved by technology

However, cooling systems suitable for traditional computing devices such as high-performance computers have almost no restrictions on the space occupation or energy consumption of the cooling system, and often have large volume, noise, and power consumption, which cannot meet the cooling needs of portable mobile electronic devices

[0003] At present, the heat dissipation effect of common mobile phone cases on the market is generally not good, and the number of heat dissipation mobile phone cases designed with enhanced heat transfer theory and technology is very small.

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