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A motherboard system and server

A motherboard and sub-node technology, applied in the direction of instruments, machines/engines, pump control, etc., can solve problems such as motherboard component failure, server performance and stability impact, power shutdown, etc. Crosstalk reduction effect

Active Publication Date: 2019-02-15
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heat dissipation design is an important point in the design of dual-node servers. Poor heat dissipation will lead to the failure of components on the motherboard, and even cause the power to be shut down in severe cases, which will affect the performance and stability of the server.

Method used

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  • A motherboard system and server
  • A motherboard system and server
  • A motherboard system and server

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Embodiment Construction

[0030] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0031] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0032] As described in the background technology, placing two computing nodes in a dual-node server achieves the performance of two servers and saves cabinet space, but heat dissipation design is a key point in the design of a dual-node server, and poor heat dissipation will lead to The failure of components on...

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PUM

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Abstract

A motherboard system and a server are provided, the motherboard system consists of several independent sub-nodes for computing several points, These sub-nodes are arranged in one direction in turn, the power supply is arranged at the end of the sub-node and is located between two adjacent sub-nodes, an isolation air duct is arranged between the adjacent sub-nodes and an isolation cover is arrangedon the power supply, the isolation cover has an air inlet and an air outlet, and the air inlet faces the port of the gap of the isolation air duct. As such, that space where the sub-node is located is separated by an isolation cover which isolates the air duct and the power supply, and the hot air crosstalk between adjacent sub-nodes is greatly reduced, so that the hot air backflow between adjacent sub-nodes is greatly reduce, and the heat dissipation performance of the system is improved.

Description

technical field [0001] The invention relates to the field of computer equipment, in particular to a motherboard system and a server. Background technique [0002] With the continuous development of computer technology, servers are developing in the direction of high density, low power consumption and high processing capacity, and the dual-node server technology has emerged for this purpose. [0003] The dual-node server is to place two computing nodes in one chassis, and each computing node operates independently, which improves the computing power of the server, realizes the performance of two servers, and saves cabinet space at the same time. Heat dissipation design is an important point in the design of a dual-node server. Poor heat dissipation will lead to failure of components on the motherboard, and in severe cases, it will even cause the power to be shut down, which will affect the performance and stability of the server. Contents of the invention [0004] In view ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20F04D27/00
CPCF04D27/004G06F1/183G06F1/20
Inventor 于光义
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD