Heat dissipation device applied to 3D integrated circuit

Abstract

The invention provides a heat dissipation device applied to a 3D integrated circuit. The heat dissipation device comprises a 3D integrated circuit, an evaporator and a condenser; an integrated circuitmicro-channel is arranged in the 3D integrated circuit, and the integrated circuit micro-channel is used for radiating the upper part of the 3D integrated circuit; the evaporator is arranged below the 3D integrated circuit and is tightly attached to the 3D integrated circuit, and the evaporator is used for carrying out heat dissipation on the lower part of the 3D integrated circuit, and providingdriving capillary force for the working medium circulation flow of the whole radiator; the condenser is connected with the integrated circuit micro-channel and the working medium flow inlet and outlet of the evaporator through a circulation pipeline separately, and the condenser is used for cooling the working medium flowing out of the evaporator, and sending the working medium to the integratedcircuit micro-channel, and cooling the working medium flowing out of the integrated circuit micro-channel, and sending the working medium to the evaporator. The micro-channel cooling technology and the loop heat pipe technology are combined, so that the heat dissipation efficiency is high, the heat dissipation performance is good, and the heat dissipation problem of the 3D integrated chip can be completely solved.

Description

technical field [0001] The present disclosure relates to the field of heat dissipation of electronic chip integrated circuits, in particular to a self-driven cooperative heat dissipation technology of 3D integrated circuit chips and systems. Background technique [0002] Since Intel founder Gordon Moore proposed "Moore's Law" in 1965, the density of microelectronic devices has almost followed the prediction of "Moore's Law". Up to now, when microelectronic devices have developed to extremely low feature sizes, the development of microelectronic devices predicted by "Moore's Law" has encountered a bottleneck. In order to continue or surpass "Moore's Law", microelectronics manufacturing has developed from two-dimensional (2D) to three-dimensional (3D), and 3D circuit packaging technology that stacks and packages chips has emerged as the times require. In particular, the TSV technology that can penetrate silicon chips has the advantages of high integration, low power consumpti...

AI Technical Summary

Problems solved by technology

The vertical stacking of 3D chips in a 3D integrated circuit doubles the number of power devices per unit area, which in turn leads to a doubled increase in heat generation

However, the single micro-channel cooling technology requires the input of additional pumping power. As the heat dissipation of the 3D integrated circuit chip increases, the pumping power gradually increases.

The need for additional pump work will undoubtedly increase the complexity of the cooling system and reduce the stability of the system

At the same time, the three-dimensional space structure of the 3D integrated circuit makes the heat pipe cooling technology not have the potential to completely solve the heat dissipation requirements of the 3D integrated circuit

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