Cutting technology-based ceramic support dam formation method

Abstract

The invention discloses a cutting technology-based ceramic support dam formation method. The cutting technology-based ceramic support dam formation method comprises the following steps of 1, metalizing a corresponding part, used for electroplating, of a surface of a ceramic plate; 2, fabricating an independent circuit and an annular copper plating layer by an electroplating mode; 3, electroplatingand thickening the annular copper plating layer to a required height in a layer-by-layer way to form a metal dam; and 4, cutting a part of an inner side surface of the metal dam by a cutting method to form a cuboid structure with a smooth inner side surface. A rough inner surface of the metal dam is removed, the inner surface is smooth, the glossiness of the surface can be improved, and a reflecting effect is better; and moreover, a part of the metal dam is removed by a cutting mode, the wall thickness of the dam can be thinner, so that the internal space of the dam is expanded, larger particle wafer can be placed in the dam, and the configuration of a large-power wafer is facilitated.

Description

technical field [0001] The present invention relates to LED, laser device, power device and other related semiconductor device field technologies, in particular to a cutting technology-based ceramic support dam forming method. Background technique [0002] For optical devices currently requiring airtight packaging, it is usually necessary to set metal dams on the ceramic substrate, and the space formed by the metal dams can be filled with packaging glue, so as to achieve better airtightness. In the preparation process of the ceramic substrate, the metal dam can be built up by layer-by-layer electroplating to form a certain height. However, due to the use of electroplating, the line width of the circuit surface graphics cannot be less than 300 microns, otherwise it will not be electroplated because the graphic lines are too narrow. Therefore, after the finished LED ceramic bracket is made, the width of the metal dam is greater than 300 microns. The inner reflective cup surro...

AI Technical Summary

Problems solved by technology

However, due to the use of electroplating, the line width of the circuit surface graphics cannot be less than 300 microns, otherwise it will not be electroplated because the graphic lines are too narrow. Therefore, after the finished LED ceramic bracket is made, the width of the metal dam is greater than 300 microns. The internal reflector cup surrounded by metal dams has a small space, which can only accommodate small light-emitting chips, and cannot achieve high-power light emission in a small space

In addition, due to the layer-by-layer electroplating method, layer marks will be formed on the side wall of the metal dam, and the reflection effect is poor.

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