A Chip Parameter Multiple Programming Circuit Based on Fuse Technology

Abstract

A circuit for multiple times programming of chip parameters based on fuse technology, comprising: a blowing commander; four fuses; four MOS tubes, the gate of each MOS tube is connected to the blowing commander, and receives a blowing command; A first fuse is connected between the drain of the first MOS tube and the drain of the second MOS tube, a second fuse is connected between the source of the first MOS tube and the source of the second MOS tube, and the first MOS tube The drain of the second MOS tube is connected to the second resistor, the drain of the second MOS tube is connected to the first resistor, the source of the first MOS tube is connected to the third resistor, the source of the second MOS tube is connected to the fourth resistor and connected to the positive pole of the comparator ; Connect the third fuse between the drain of the third MOS tube and the drain of the fourth MOS tube, connect the fourth fuse between the source of the third MOS tube and the source of the fourth MOS tube, and the third MOS tube The drain of the tube is connected to the sixth resistor, the drain of the fourth MOS tube is connected to the fifth resistor, the source of the third MOS tube is connected to the seventh resistor, the source of the second MOS tube is connected to the eighth resistor and connected to the comparator. negative electrode.

Description

technical field [0001] The invention relates to a chip parameter multi-programming circuit based on fuse technology. Background technique [0002] In the chip manufacturing process, affected by factors such as process deviation, circuit mismatch, and different chip production batches, the parameters of the produced chip deviate greatly from the design simulation simulation values. This brings great difficulties to the design of analog circuits with higher requirements on parameters. Therefore, when designing a circuit, the designer will add a trimming circuit to the chip. After the chip is manufactured by the process line, the chip needs to be tested first, and the parameters that do not meet the circuit requirements are permanently programmed with the trimming circuit to complete the parameter adjustment of the circuit, so that the circuit parameters are closer to the preset value, so as to meet the design Require. In addition, sensor components need to be designed for g...

AI Technical Summary

Problems solved by technology

[0008] If the laser fusing method is used, the stress generated by the packaging will affect the corrected parameters during chip processing, so when the accuracy of the parameters to be corrected is relatively high, it needs to be fused after packaging, which is not easy to achieve

And for the semiconductor manufacturing process, the precision of the laser beam is low, and a wide area cutting is required to reduce the impact of the precision of the laser beam, which will increase the area of ​​the chip and increase the cost

[0009] If the flash memory method is introduced into the chip design, it is necessary to add a high-voltage circuit, which will increase the complexity of the chip design and increase the cost of chip manufacturing.

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