Method for coupling silicon-based optoelectronic chip and single-mode optical fiber

An optoelectronic chip and single-mode fiber technology, which is applied to the coupling of optical waveguides, light guides, optics, etc., can solve the problems of low coupling efficiency between single-mode fiber and silicon waveguide, and achieve the effect of improving coupling tolerance and improving coupling efficiency.

Pending Publication Date: 2019-03-01
HANGZHOU XIN YUN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is: the current technica

Method used

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  • Method for coupling silicon-based optoelectronic chip and single-mode optical fiber
  • Method for coupling silicon-based optoelectronic chip and single-mode optical fiber
  • Method for coupling silicon-based optoelectronic chip and single-mode optical fiber

Examples

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Example Embodiment

[0027] Example one:

[0028] A method for coupling a silicon-based optoelectronic chip and a single-mode fiber 2 is applied to the coupling of a single-mode fiber 2 and a silicon waveguide 5, such as figure 1 As shown, it is a schematic diagram of the coupling structure of the first embodiment, such as figure 2 As shown, it is a schematic side sectional view of the coupling structure of Embodiment 1, as image 3 Shown is a top view of the coupling structure of Embodiment 1. In this embodiment, a silicon dioxide layer 4 is deposited and grown on a silicon substrate 8. The silicon waveguide 5 is arranged in the silicon dioxide layer 4, and the end surface of the single-mode optical fiber 2 is processed into a convex curved surface. There is a gap between the single-mode fiber 2 and the silicon dioxide layer 4. At least a section of low-refractive-index waveguide 6 is arranged between the single-mode fiber 2 and the silicon waveguide 5. The low-refractive-index waveguide 6 is in the ...

Example Embodiment

[0030] Embodiment two:

[0031] A method for coupling a silicon-based optoelectronic chip and a single-mode optical fiber 2. In this embodiment, the installation process of the single-mode optical fiber 2 is specifically improved, such as Figure 4 Shown is the structural diagram of the optical fiber installer in the second embodiment, such as Figure 5 As shown, it is a schematic diagram of the implementation part of the optical fiber installer in the second embodiment. The single-mode optical fiber 2 is installed to the coupling position through the optical fiber installer. The optical fiber installer includes a connecting frame 9, a screw base 14, a screw 15, a rotating handle 10, and two A sliding rod 16, a slider 13, an optical fiber holding base 17 and an optical fiber holding press block 11. The optical fiber holding base 17 is fixedly connected to the slider 13, and the optical fiber holding press block 11 is closely connected to the optical fiber holding base 17 V-shaped ...

Example Embodiment

[0032] Embodiment three:

[0033] A method for coupling a silicon-based optoelectronic chip and a single-mode optical fiber 2. In this embodiment, the installation process of the single-mode optical fiber 2 is specifically improved, such as Image 6 As shown, it is a schematic diagram of the structure of the anti-collision device of the optical fiber installer in the third embodiment. The optical fiber installer used when installing the single-mode optical fiber 2 to the coupling position in this embodiment also includes an anti-collision device, which is located at the exit end of the single-mode optical fiber 2 When moving to the coupling position, the slider 13 is locked. The refractive index difference between the silicon waveguide 5 and silicon dioxide is huge, so the silicon waveguide 5 used in conjunction with silicon dioxide has a strong confinement effect on light, so the silicon waveguide 5 can have a smaller size, usually only a dozen. To tens of micrometers, too small...

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Abstract

The invention relates to the technical field of optical communication devices, and specifically relates to a method for coupling a silicon-based optoelectronic chip and a single-mode optical fiber. Asilicon dioxide layer is deposited and grown on a silicon substrate, and silicon waveguide is disposed in the silicon dioxide layer. An end face of the single-mode optical fiber is arranged in a convex curved shape. A gap is between the single-mode optical fiber and the silicon dioxide layer. At least one section of low refractive index waveguide is disposed between the single-mode optical fiber and the silicon waveguide. The low refractive index waveguide has a sheet-shaped rectangular parallelepiped shape and both ends have sharp corners. An incident end of the silicon waveguide is a sharp corner. A fiber core outgoing end of the single-mode optical fiber is aligned with the incident end of the low refractive index waveguide. The low refractive index waveguide partially overlaps the silicon waveguide in a horizontal direction, and a gap is between the low refractive index waveguide and the silicon waveguide in a vertical direction. The low refractive index waveguide and the silicon dioxide layer on both sides of the silicon waveguide are provided with notch grooves, and depth of the notch groove is greater than the depth of the silicon waveguide buried in the silicon dioxide layer. Beneficial effects of the method are that coupling efficiency and tolerance between the single-mode optical fiber and the silicon optical chip are improved through transition of the low refractiveindex waveguide.

Description

technical field [0001] The invention relates to the technical field of optical communication equipment, in particular to a coupling method between a silicon-based optoelectronic chip and a single-mode optical fiber. Background technique [0002] With the development of the Internet and mobile communication networks, the demand for high-speed communication devices in data centers and 5G communication is also increasing. Silicon-based optoelectronics, as one of the means that can significantly reduce the manufacturing cost of optical devices, has also attracted market attention. Since silicon waveguides have the advantages of low transmission loss and high refractive index in the communication band, silicon-based optoelectronic devices have the advantages of high scalability and high integration. Due to the high integration characteristics of silicon-based optoelectronic chips, the size of silicon waveguides is greatly different from that of existing optical communication dev...

Claims

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Application Information

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IPC IPC(8): G02B6/26G02B6/30
CPCG02B6/262G02B6/30
Inventor 王宗旺夏晓亮
Owner HANGZHOU XIN YUN TECH CO LTD
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