Semiconductor element
A semiconductor and component technology, applied in the field of electronic equipment, can solve the problem of poor heat dissipation effect of semiconductor devices, and achieve the effect of improving the working effect, prolonging the service life and good heat dissipation effect.
Pending Publication Date: 2019-03-01
深圳市元拓高科半导体有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to provide a semiconductor element to solve the problem of poor heat dissipation of semiconductor devices in the prior art
Method used
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[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0035] In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the qua...
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The invention is applicable to the technical field of electronic equipment, and provides a semiconductor element. The semiconductor element comprises a substrate, a chip, a plurality of pins arrangedon the periphery of the substrate at intervals, and a rubber base which is solidified and formed on the substrate, wherein a through hole is formed in the rubber base; the semiconductor element further comprises a heat conduction cooling fin arranged on the rubber base; a convex part is arranged on the heat conduction cooling fin; and the convex part penetrates through the through hole and is attached to the chip. The convex part of the heat conduction cooling fin penetrates through the through hole of the rubber base and is attached to the chip, so that a part of heat of the chip can be transferred to the heat conduction cooling fin through the convex part and diffused, and a part of heat of the chip can be transmitted to the substrate and diffused; therefore, the semiconductor element can diffuse the heat of the chip on the two sides of the rubber base, and the heat dissipation effect of the semiconductor element is good; the plurality of pins are arranged and are electrically connected with the chip separately, so that a part of heat of the chip can be transferred to all the pins for diffusion, and communication with plurality of external devices also can be achieved, so that the working use efficiency of the semiconductor element can be further improved.
Description
technical field [0001] The invention is applicable to the technical field of electronic equipment, and more specifically relates to a semiconductor element. Background technique [0002] A semiconductor device refers to an object whose conductivity is between a conductor and an insulator at room temperature. Because its conductivity can be controlled, ranging from an insulator to a conductor, it is widely used in the technical field of electronic equipment. [0003] Existing semiconductor devices mainly transfer heat to a PCB (Printed Circuit Board, printed circuit board) bonded thereto through the metal sheet attached to the chip, and then transfer the heat to peripheral components to achieve heat dissipation. Since the semiconductor device can only realize one-sided heat dissipation, the heat dissipation effect of the semiconductor device is poor, which will affect the working performance and efficiency of the semiconductor device. If the temperature is too high, the chip ...
Claims
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IPC IPC(8): H01L23/367H01L23/495
CPCH01L23/3672H01L23/49568H01L2224/48247H01L2224/49171
Inventor 伍昭云郭正谡
Owner 深圳市元拓高科半导体有限公司