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Support device and semiconductor inspection device

A support device and a support rod technology, applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as prone to failure

Active Publication Date: 2021-01-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a support device and a semiconductor detection device to solve the problem that the existing support device and semiconductor detection device are prone to failure during the loading and unloading process

Method used

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  • Support device and semiconductor inspection device
  • Support device and semiconductor inspection device
  • Support device and semiconductor inspection device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] figure 1 It is a three-dimensional schematic diagram of a supporting device in an embodiment of the present invention. refer to figure 1 , the supporting device 10 includes an installation base 100, a driving assembly 200 and a supporting adsorption unit. The supporting device 10 may preferably include a rail assembly 400 or a flow sensor 500 .

[0035] The driving assembly 200 is fixed on the installation base 100 , and the driving assembly 200 is used to drive the support and adsorption unit up and down. The driving assembly 200 can be a linear motor, an air cylinder, a hydraulic cylinder, and the like.

[0036] The supporting and absorbing unit is used to carry and absorb plate-shaped workpieces. The support adsorption unit includes an H-shaped support frame and a plurality of hollow support rods 320 . The drive assembly 200 is used to drive the H-shaped support frame up and down. The H-shaped support frame is fixedly connected with a plurality of support rods ...

Embodiment 2

[0052] The difference between the supporting device 10 in this embodiment and the supporting device 10 in Embodiment 1 is that in this embodiment, the supporting and absorbing unit of the supporting device 10 further includes a plurality of auxiliary supporting rods 340 .

[0053] refer to image 3 , image 3 It is a three-dimensional schematic diagram of a support device in another embodiment of the present invention, the auxiliary support rod 340 is fixedly connected with the H-shaped support frame, and the auxiliary support rod 340 is used to support the plate-shaped workpiece. By fixing multiple auxiliary support rods 340 on the H-shaped support frame and supporting the plate-shaped workpiece with multiple auxiliary support rods 340, the warpage of the plate-shaped workpiece can be further reduced, and the adsorption of the support device 10 to the plate-shaped workpiece can be expanded. area, so that the overall surface accuracy of the plate-shaped workpiece after adsorp...

Embodiment 3

[0058] This embodiment provides a semiconductor detection device. refer to Figure 4 and Figure 5 , Figure 4 is a front view of a semiconductor detection device in an embodiment of the present invention, Figure 5 It is a top view of a semiconductor inspection device in an embodiment of the present invention, and the semiconductor inspection device includes a transfer manipulator 20, a board library 30, a substrate stage 40, an alignment mechanism and the support device 10 in the above embodiment. The semiconductor inspection device preferably includes an alignment mechanism. The semiconductor detection device includes a material transmission working area and a material adsorption working area. Wherein the board warehouse 30 and the transfer manipulator 20 are located in the material transfer area, and the support device 10 and the substrate table 40 are located in the material adsorption work area.

[0059] In this embodiment, the semiconductor detection device prefera...

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PUM

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Abstract

The invention provides a support device and a semiconductor detection device, and is used for supporting plate-shaped workpieces. The support device comprises an installation base, a driving assemblyfixed on the installation base, and a support adsorption unit used for supporting and adsorbing a plate-shaped workpiece, the support adsorption unit comprises an H-shaped support frame and a plurality of hollow support rods, the H-shaped support frame is fixedly connected with the plurality of support rods, the support rods are used for supporting and adsorbing the plate-shaped workpiece, the driving assembly is used for driving elevation of the H-shaped support frame, and the H-shaped support frame drives elevation of the plurality of support rods. According to the support device and the semiconductor detection device, the adsorption area of the plate-shaped workpiece by the support device can be extended, the global surface precision of the adsorbed plate-shaped workpiece is improved, and the frequency of fault occurrence of the support device in processes of feeding and discharging is reduced.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to a support device and a semiconductor detection device. Background technique [0002] Currently, displays play an important role in people's lives. In the field of display, flat panel display (FPD) represented by liquid crystal display (Liquid Crystal Display, LCD) and the newly popular organic light-emitting display (Organic Light-Emitting Diode, OLED) has occupied the mainstream market, providing people with A more ideal display screen has also had a huge impact on the existing display industry structure. [0003] In the field of flat panel displays, thin film transistor testing equipment plays a vital role from product development to final mass production. The thin film transistor detection equipment can effectively shorten the development cycle of the flat panel display, improve the stability and other performances of the flat panel display, and effectively redu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/687H01L21/66
CPCH01L21/6838H01L21/6875H01L22/12
Inventor 施胜男朱岳彬徐兵杨辅强王保亮
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD