Support device and semiconductor inspection device
A support device and a support rod technology, applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as prone to failure
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Embodiment 1
[0034] figure 1 It is a three-dimensional schematic diagram of a supporting device in an embodiment of the present invention. refer to figure 1 , the supporting device 10 includes an installation base 100, a driving assembly 200 and a supporting adsorption unit. The supporting device 10 may preferably include a rail assembly 400 or a flow sensor 500 .
[0035] The driving assembly 200 is fixed on the installation base 100 , and the driving assembly 200 is used to drive the support and adsorption unit up and down. The driving assembly 200 can be a linear motor, an air cylinder, a hydraulic cylinder, and the like.
[0036] The supporting and absorbing unit is used to carry and absorb plate-shaped workpieces. The support adsorption unit includes an H-shaped support frame and a plurality of hollow support rods 320 . The drive assembly 200 is used to drive the H-shaped support frame up and down. The H-shaped support frame is fixedly connected with a plurality of support rods ...
Embodiment 2
[0052] The difference between the supporting device 10 in this embodiment and the supporting device 10 in Embodiment 1 is that in this embodiment, the supporting and absorbing unit of the supporting device 10 further includes a plurality of auxiliary supporting rods 340 .
[0053] refer to image 3 , image 3 It is a three-dimensional schematic diagram of a support device in another embodiment of the present invention, the auxiliary support rod 340 is fixedly connected with the H-shaped support frame, and the auxiliary support rod 340 is used to support the plate-shaped workpiece. By fixing multiple auxiliary support rods 340 on the H-shaped support frame and supporting the plate-shaped workpiece with multiple auxiliary support rods 340, the warpage of the plate-shaped workpiece can be further reduced, and the adsorption of the support device 10 to the plate-shaped workpiece can be expanded. area, so that the overall surface accuracy of the plate-shaped workpiece after adsorp...
Embodiment 3
[0058] This embodiment provides a semiconductor detection device. refer to Figure 4 and Figure 5 , Figure 4 is a front view of a semiconductor detection device in an embodiment of the present invention, Figure 5 It is a top view of a semiconductor inspection device in an embodiment of the present invention, and the semiconductor inspection device includes a transfer manipulator 20, a board library 30, a substrate stage 40, an alignment mechanism and the support device 10 in the above embodiment. The semiconductor inspection device preferably includes an alignment mechanism. The semiconductor detection device includes a material transmission working area and a material adsorption working area. Wherein the board warehouse 30 and the transfer manipulator 20 are located in the material transfer area, and the support device 10 and the substrate table 40 are located in the material adsorption work area.
[0059] In this embodiment, the semiconductor detection device prefera...
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