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Power module and power conversion apparatus

一种功率模块、电连接的技术，应用在输出功率的转换装置、交流功率输入变换为直流功率输出、电路等方向，能够解决不容易拆卸、耗费成本等问题，达到容易拆卸的效果

Active Publication Date: 2019-03-05
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the power module of Patent Document 1, the insulating substrate (power part) on which the semiconductor element is mounted and the case are integrally formed by encapsulating resin, so it is not easy to disassemble, and when the semiconductor element fails, the normal case needs to be assembled together replace
In particular, for the semiconductor element and the surrounding area of ​​the semiconductor element as a heat source, replacement of components is easier than that of the case and the surrounding area of ​​the case. Then there is a problem of excessive consumption of costs associated with the replacement work

Method used

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  • Power module and power conversion apparatus
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  • Power module and power conversion apparatus

Examples

Experimental program
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Embodiment approach 1

[0021] The power module 50 in Embodiment 1 will be described. figure 1 It is a sectional view showing the power module 50 according to the first embodiment. Furthermore, in addition to figure 1 In other drawings, the same reference numerals represent the same or corresponding parts. At once figure 1 In the power module shown, the power section is composed of a semiconductor element 1 , an insulating substrate 2 , internal terminals 3 , and conductive wires 5 . The power module 50 is configured to include: a power unit configured by bonding a semiconductor element 1 to an insulating substrate 2 via a conductive member, and the power unit is resin-encapsulated with a sealing material 4; It is exposed from the sealing material 4 and connected to the elastic member 12 . In addition, the semiconductor element 1 may be a switching element or a diode, and may be, for example, an IGBT (Insulated Gate Bipolar Transistor) or a PN diode. In addition, the number of semiconductor elem...

Embodiment approach 2

[0031] The power module 51 according to Embodiment 2 will be described. image 3 It is a sectional view showing the power module 51 according to the second embodiment. In power module 51 according to Embodiment 2, recessed portion 6 is formed at the end portion of internal terminal 3 exposed from encapsulant 4 .

[0032] According to power module 51 of Embodiment 2, recessed portion 6 is formed at the end portion of internal terminal 3 exposed from encapsulating material 4 . By inserting the elastic member 12 into the recess 6 , electricity can be supplied not only from the bottom surface of the recess 6 but also from the side surface of the recess 6 , thereby increasing the conduction area and increasing the current capacity of the power module 51 . In addition, since the elastic member 12 is supported by the concave portion 6 when the power module 51 is attached to the heat sink 7 , the attachment to the heat sink 7 can be easily performed.

Embodiment approach 3

[0034] The power module 52 according to Embodiment 3 will be described. Figure 4It is a sectional view showing the power module 52 according to the third embodiment. The power module 52 of Embodiment 3 is characterized in that the elastic member is the multi-contact spring 14 . In addition, the multi-contact spring 14 only needs to have a plurality of contacts, for example, it may be a coil wave spring in which a coil spring in a helical state is formed into a wave shape, such as Figure 5 A leaf spring 13 as shown.

[0035] According to the power module 52 of Embodiment 3, since the elastic member is the multi-contact spring 14 , the contact area is larger than that of the coil spring, so the current conduction area can be increased, and the current capacity of the power module 52 can be increased. In addition, since the multi-contact spring 14 can generate a larger elastic force with a short stroke than a coil spring, it is possible to easily perform the work of attaching...

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PUM

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Abstract

The object is to obtain a power module (50), being easily detachable for an insulating substrate (2) on which a semiconductor device (1) is mounted and a case (10). The power module (50) includes an insulating substrate (2), a semiconductor device (1) provided on the insulating substrate, an internal terminal (3) provided on the insulating substrate and electrically connected to the semiconductordevice (1), a sealing material (4) that seals the internal terminal (3), the semiconductor device (1) and the insulating substrate (2) so that an end portion of the internal terminal (3) is exposed, acase (10) that is separate from the sealing material (4) and covers the sealing material (4) and an elastic member (12) that connects the case (10) and the end portion of the internal terminal (3).

Description

technical field [0001] The present invention relates to a structure of a power module and a power conversion device including the power module. Background technique [0002] When a power module fails, the main body of the power module and peripheral parts need to be replaced. Therefore, it is necessary to improve the replacement workability of the power module and reduce the cost associated with the replacement. In Patent Document 1, in order to easily detach the control board from the insulating board on which the semiconductor device is mounted, a case covering the insulating board on which the semiconductor device is mounted is connected to the control board by a member having elastic force. [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 6-45515 [0004] In the power module of Patent Document 1, the insulating substrate (power part) on which the semiconductor element is mounted and the case are integrally formed by encapsulating resin, so it is not...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/48H01L25/07
CPCH01L23/3121H01L23/481H01L25/07H01L2224/291H01L2224/32225H01L2224/73265H05K7/209H01L23/053H01L23/10H01L23/4006H01L24/48H01L2023/4031H01L2023/4081H01L2023/4087H01L2224/48091H01L2224/48227H01L2924/1203H01L2924/13055H01L2924/1425H02M1/007H05K7/14329H01L2924/00014H01L2924/014H01L2924/00H05K7/1432H01L23/24H01L2023/405H01L2224/48106H02M1/08H02M7/5395
Inventor 中原贤太
Owner MITSUBISHI ELECTRIC CORP
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