3D simulation data generation method and system, computer storage medium and device

A simulation data and 3D technology, applied in computing, 3D modeling, image data processing, etc., can solve problems such as the inability to realize the automatic generation of PCB design data to 3D simulation data, so as to eliminate errors, reduce work difficulty, and solve data incompleteness Effect

Inactive Publication Date: 2019-03-08
VAYO SHANGHAI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a method, system, computer storage medium and equipment for generating 3D simulation data, which is used to solve the problem that the prior art cannot realize the automation of PCB design data to 3D simulation data. generated questions

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  • 3D simulation data generation method and system, computer storage medium and device
  • 3D simulation data generation method and system, computer storage medium and device
  • 3D simulation data generation method and system, computer storage medium and device

Examples

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Embodiment 1

[0044] This embodiment provides a method for generating 3D simulation data, including:

[0045] Acquiring PCB design data; the PCB design data includes a circuit board and at least one component;

[0046] Extracting three-dimensional data of components matching each component from a prestored three-dimensional database of components, and extracting three-dimensional data of circuit boards matching the circuit board from the PCB design data;

[0047]According to the test requirements of the user, import the 3D data of the circuit board and the 3D data of components into the pre-stored mechanical simulation software to generate the 3D model required for the mechanical simulation test; or

[0048] Importing the 3D data of the circuit board and the 3D data of components into the pre-stored finite element analysis software to generate the 3D model required for structural mechanics analysis and testing; or

[0049] The 3D model required for the mechanical simulation test is connect...

Embodiment 2

[0106] This embodiment provides a system for generating 3D simulation data, including:

[0107] An acquisition module, configured to acquire PCB design data; the PCB design data includes a circuit board and at least two components;

[0108] An extraction module, configured to extract three-dimensional data of components matching each component from a pre-stored three-dimensional database of components, and extract three-dimensional data of circuit boards matching the circuit board from the PCB design data;

[0109] The model generation module is used to import the three-dimensional data of the circuit board and the three-dimensional data of components into the pre-stored mechanical simulation software according to the test requirements of the user, so as to generate the 3D model required for the mechanical simulation test; The 3D data of the board and the 3D data of components are imported into the pre-stored finite element analysis software to generate the 3D model required f...

Embodiment 3

[0125] This embodiment provides a device, please refer to image 3 , is shown as a schematic diagram of the principle structure of the device in an embodiment. Such as image 3 As shown, the device 3 includes: a processor 31, a memory 32, a transceiver 33, a communication interface 34 or / and a system bus 35; the memory 32 and the communication interface 34 are connected to the processor 31 and the transceiver 33 through the system bus 35 and To complete mutual communication, the memory 32 is used to store computer programs, the communication interface 34 is used to communicate with other devices, the processor 31 and the transceiver 33 are used to run the computer programs, so that the device 3 executes as described in Embodiment 1. Each step of the method for generating 3D simulation data.

[0126] The system bus mentioned above may be a Peripheral Component Interconnect (PCI for short) bus or an Extended Industry Standard Architecture (EISA for short) bus or the like. The...

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Abstract

The invention provides a 3D simulation data generation method and system, a computer storage medium and a device. The generation method comprises the following steps of obtaining the PCB design data;extracting three-dimensional data of components from a pre-stored three-dimensional database of components and extracting three-dimensional data of circuit board; according to the test requirements ofusers, importing the 3D data of circuit board and components into the pre-stored mechanical simulation software to generate the 3D model for mechanical simulation test; or importing the three-dimensional data of circuit board and components into the pre-stored finite element analysis software to generate the three-dimensional model needed for structural mechanics analysis and testing; or dockingthe 3D model needed for mechanical simulation test into the finite element analysis software to generate the 3D model needed for structural mechanics analysis test. The invention can eliminate a lot of repetitive work, replace the manual work with automation, reduce the working difficulty, and realize the fast conversion of PCB design data to simulation software.

Description

technical field [0001] The invention belongs to the technical field of electronic manufacturing, and relates to a generation method and system, in particular to a generation method, system, computer storage medium and equipment of 3D simulation data. Background technique [0002] The application of simulation software for simulation testing in the electronics manufacturing industry is of great significance for improving the quality of electronic products, shortening the design cycle, and improving the competitiveness of electronic products. However, the existing method of connecting PCB design data to finite element simulation software or mechanical simulation software to generate 3D simulation data is very complicated, cumbersome and time-consuming. [0003] For example: there are the following disadvantages: [0004] 1. Since the IDF data output by the EDA software is an imprecise three-dimensional data, it only has the outer frame data but no internal structure data, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50G06T17/00
CPCG06F30/367G06T17/00
Inventor 武纪宏钱胜杰刘丰收
Owner VAYO SHANGHAI TECH
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