A kind of manufacturing method of display panel and display device
A display panel and panel technology, which is applied in the manufacture of semiconductor/solid-state devices, diodes, semiconductor devices, etc., can solve the problems of increasing the influence range of laser heat energy, affecting the film quality of the thin film packaging layer, and the collapse of the thin film packaging layer. Production time, avoid laser burns, avoid damaging effects
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Embodiment 1
[0026] Example 1, see Figure 1A to Figure 1E-2 It is a schematic diagram of a manufacturing process of a display panel according to an embodiment of the present invention.
[0027] The manufacturing method of the display panel in Embodiment 1 of the present invention includes:
[0028] First, refer to Figure 1A , providing a base substrate 110 and a rigid substrate 210 . In this embodiment, the size of the rigid substrate 210 and the base substrate 110 match, that is, the size of the rigid substrate 210 is equal to or slightly larger than that of the base substrate 110 , and the base substrate 110 is a medium-sized substrate.
[0029] The base substrate 110 described here can be made of glass, plastic, metal or ceramics, and the base substrate 110 in this embodiment is made of inorganic glass. The rigid substrate 210 can also be made of glass, plastics, metal or ceramics. In this embodiment, the rigid substrate 210 is made of plexiglass, and the material of the plexiglass ...
Embodiment 2
[0040] Embodiment 2, another embodiment of the present invention relates to a manufacturing method of a display panel, which differs from the manufacturing method in Embodiment 1 in that, first, refer to Figure 2A , providing a base substrate 110 and a plurality of rigid substrates 210 . The size of the plurality of rigid substrates 210 that are tightly spliced together is equal to or slightly larger than the size of the base substrate 110 , and the base substrate 110 at this time is a medium-sized substrate.
[0041] The second step, refer to Figure 2B 1. A TFT array layer 120 , an OLED device layer 130 and a thin film encapsulation layer 140 are sequentially disposed on the base substrate 110 , and a peelable adhesive layer 220 is disposed on each of the plurality of rigid substrates 210 .
[0042] The third step, refer to Figure 2C , all the rigid substrates 210 provided with the peelable adhesive layer 220 are spliced together to form a large-sized rigid substrate...
Embodiment 3
[0045] Embodiment 3, with reference to image 3 , another embodiment of the present invention relates to another manufacturing method of the display panel, which differs from the manufacturing method in Embodiment 1 or Embodiment 2 in that in the second step, PI ( polyimide, polyimide) layer 150, array layer 120, OLED device layer 130 and thin film encapsulation layer 140, that is, before preparing the array layer 120, first set the PI layer 150 on the base substrate 110, wherein the PI layer is a A flexible material layer is currently commonly used in the production of flexible display panels as a flexible substrate layer for the production of TFT array layers, which is more conducive to the realization of foldable or rollable flexible display panels.
[0046] Except for the difference in the above-mentioned manufacturing method, other process steps of this embodiment are the same as those of Embodiment 1 or Embodiment 2.
[0047] In the above three embodiments, before laser...
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Abstract
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