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A kind of manufacturing method of display panel and display device

A display panel and panel technology, which is applied in the manufacture of semiconductor/solid-state devices, diodes, semiconductor devices, etc., can solve the problems of increasing the influence range of laser heat energy, affecting the film quality of the thin film packaging layer, and the collapse of the thin film packaging layer. Production time, avoid laser burns, avoid damaging effects

Active Publication Date: 2021-02-09
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And it is necessary to attach multiple pieces of protective film to the thin film encapsulation layer one by one or one by one corresponding to the preset area on the medium-sized substrate. The base substrate is cut by laser irradiation, and the medium-sized base substrate is cut and separated into multiple small-sized panels. In the next step, the protective film on each independently opened small-sized panel is peeled off to obtain multiple display panels. The main purpose of the protective film is to reduce the stress generated during cutting by laser irradiation, which will lead to the failure of the thin-film packaging layer, and to prevent the cutting debris from damaging the thin-film packaging layer. When filming, the laser will directly irradiate the protective film, which will cause the protective film to be burned by the laser, increase the influence range of laser thermal energy, and then affect the film quality of the thin film packaging layer. Secondly, after the protective film is peeled off , can only take away part of the debris, and some debris will still remain on the thin film encapsulation layer. In addition, if the protective film layer cannot be peeled off immediately after being attached, long-term storage will cause the protective film to be separated from the protective film. The thin film encapsulation layer is tightly bonded, and when the protective film is peeled off, part of the thin film encapsulation layer or part of the OLED device layer sometimes adheres to the protective film, thus causing the display panel to become a defective product. In addition, all The above protective film can no longer be used after being stripped, resulting in an increase in production costs

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  • A kind of manufacturing method of display panel and display device
  • A kind of manufacturing method of display panel and display device
  • A kind of manufacturing method of display panel and display device

Examples

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Embodiment 1

[0026] Example 1, see Figure 1A to Figure 1E-2 It is a schematic diagram of a manufacturing process of a display panel according to an embodiment of the present invention.

[0027] The manufacturing method of the display panel in Embodiment 1 of the present invention includes:

[0028] First, refer to Figure 1A , providing a base substrate 110 and a rigid substrate 210 . In this embodiment, the size of the rigid substrate 210 and the base substrate 110 match, that is, the size of the rigid substrate 210 is equal to or slightly larger than that of the base substrate 110 , and the base substrate 110 is a medium-sized substrate.

[0029] The base substrate 110 described here can be made of glass, plastic, metal or ceramics, and the base substrate 110 in this embodiment is made of inorganic glass. The rigid substrate 210 can also be made of glass, plastics, metal or ceramics. In this embodiment, the rigid substrate 210 is made of plexiglass, and the material of the plexiglass ...

Embodiment 2

[0040] Embodiment 2, another embodiment of the present invention relates to a manufacturing method of a display panel, which differs from the manufacturing method in Embodiment 1 in that, first, refer to Figure 2A , providing a base substrate 110 and a plurality of rigid substrates 210 . The size of the plurality of rigid substrates 210 that are tightly spliced ​​together is equal to or slightly larger than the size of the base substrate 110 , and the base substrate 110 at this time is a medium-sized substrate.

[0041] The second step, refer to Figure 2B 1. A TFT array layer 120 , an OLED device layer 130 and a thin film encapsulation layer 140 are sequentially disposed on the base substrate 110 , and a peelable adhesive layer 220 is disposed on each of the plurality of rigid substrates 210 .

[0042] The third step, refer to Figure 2C , all the rigid substrates 210 provided with the peelable adhesive layer 220 are spliced ​​together to form a large-sized rigid substrate...

Embodiment 3

[0045] Embodiment 3, with reference to image 3 , another embodiment of the present invention relates to another manufacturing method of the display panel, which differs from the manufacturing method in Embodiment 1 or Embodiment 2 in that in the second step, PI ( polyimide, polyimide) layer 150, array layer 120, OLED device layer 130 and thin film encapsulation layer 140, that is, before preparing the array layer 120, first set the PI layer 150 on the base substrate 110, wherein the PI layer is a A flexible material layer is currently commonly used in the production of flexible display panels as a flexible substrate layer for the production of TFT array layers, which is more conducive to the realization of foldable or rollable flexible display panels.

[0046] Except for the difference in the above-mentioned manufacturing method, other process steps of this embodiment are the same as those of Embodiment 1 or Embodiment 2.

[0047] In the above three embodiments, before laser...

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Abstract

The invention discloses a method for preparing a display panel and a display device, wherein the method for preparing the display panel includes: providing a base substrate, on which a TFT array layer, an OLED device layer and a thin film encapsulation layer are sequentially arranged; providing at least one A hard substrate is provided with a peelable adhesive layer on the rigid substrate; the base substrate provided with the TFT array layer, the OLED device layer and the thin film encapsulation layer is attached to the hard substrate provided with a peelable adhesive layer, so that The thin film encapsulation layer is laminated with the peelable adhesive layer to obtain a laminated panel; laser irradiation and cutting is performed on the laminated panel from the side of the substrate substrate, and the substrate substrate is divided into multiple small-sized areas; from the rigid substrate The base substrate corresponding to each small-sized area is peeled off, and the thin film encapsulation layer is peeled off from the peelable adhesive layer to obtain a plurality of display panels. The invention can avoid the destruction of the thin film encapsulation layer and the OLED device layer, save production time, and the rigid substrate can be used repeatedly, reducing the production cost.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a display panel and a display device. Background technique [0002] With the continuous development of display technology, the application of flexible display technology is more and more extensive. Among the existing flexible display screens, flexible OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display screen has gradually become a product favored by the public. [0003] In the existing manufacturing method of flexible OLED display, it is necessary to carry out thin film encapsulation on the OLED device layer that has been produced on the medium-sized substrate substrate. It is bendable that can realize OLED display. In the next step, a protective film is pasted on the thin film encapsulation layer of the base substrate, and the protective film is generally made of PTE (polythylene terephthalate) material. And it is necessary to att...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L27/32
CPCH01L21/6836H01L2221/68327H10K59/50H10K59/40H10K59/1201
Inventor 李丹丹
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD