Display substrate, manufacturing method thereof, and display device
A technology for display substrates and carrier substrates, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., can solve the problems that display substrates and display devices need to be improved, and achieve the effect of small contact resistance and avoiding product yield problems.
Active Publication Date: 2021-03-19
BOE TECH GRP CO LTD
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- Claims
- Application Information
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Problems solved by technology
[0003] However, the current display substrates, their preparation methods, and display devices still need to be improved.
Method used
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Embodiment Construction
[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements including the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0029] In one aspect of the invention, the invention provides a method for preparing a display substrate. In the method, by setting a seed layer and injecting metal twice, complex processing steps such as filling metal into deep holes can be avoided, and at the same time, the connection between the LED PAD and the IC PAD can be realized. That is to say, this method can avoid forming a through hole through the entire substrate at one time, which causes the problem of complicated process caused by the difficulty of filling the deep hole...
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The invention discloses a display substrate, a preparation method thereof, and a display device. The method includes: disposing a seed layer on the first carrier substrate, and forming a substrate covering the seed layer; forming a first via hole through the substrate at a position corresponding to the seed layer, and forming a first via hole through the substrate at a position corresponding to the seed layer, and forming a first injection conductive layer in a via hole; forming a first connection terminal above the substrate, the first connection terminal is electrically connected to the seed layer through the first injection conductive layer; removing the first connection terminal A carrier substrate to expose the seed layer; forming a second connection terminal electrically connected to the seed layer. In this way, it is possible to avoid forming a through hole through the entire substrate at one time, resulting in the difficulty of subsequently filling the deep hole with metal, resulting in a complicated process.
Description
technical field [0001] The present invention relates to the field of display technology, in particular, to a display, a manufacturing method thereof, and a display device. Background technique [0002] With the development of display technology, the types of display devices and display substrates are also increasingly diversified. In addition to liquid crystal display devices, there are also some display substrates that use an external control circuit by arranging the light-emitting element on one side of the substrate (such as the top), and setting a port electrically connected to the light-emitting element on the opposite side of the substrate (such as the bottom). The light emission of the light emitting element is controlled to realize the display. Taking the display substrate based on light-emitting diodes (LEDs) as an example, generally, connection ports (IC PAD) connected to external control circuits (control ICs) are provided on the upper and lower sides of the subs...
Claims
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IPC IPC(8): H01L21/84H01L27/12
CPCH01L27/124H01L27/1259H01L27/14683H01L2933/0066H01L25/167H01L25/0753H01L33/62H01L27/1266H01L27/1218
Inventor 黄华谢昌翰狄沐昕朱小研
Owner BOE TECH GRP CO LTD