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Polyamide composite material with good tactility and easy encapsulation and preparation method thereof

A composite material and adhesive polyamide technology, applied in the field of polyamide materials, can solve the problems of low efficiency, high cost, heavy operation workload, etc., and achieve the goal of improving surface polarity, good bonding force, and good tear resistance Effect

Active Publication Date: 2019-03-22
上海日之升科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such materials are often related to the nylon matrix. Once the matrix of the reinforced nylon product changes, the general production needs to be adapted through the adjustment of the elastomer formula. The operation workload is large, the efficiency is low, and the cost is high.

Method used

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  • Polyamide composite material with good tactility and easy encapsulation and preparation method thereof
  • Polyamide composite material with good tactility and easy encapsulation and preparation method thereof
  • Polyamide composite material with good tactility and easy encapsulation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0033] Put the other components except glass fiber into the high-mixer according to the proportion in Table 1 and mix for 5-10min, then discharge to obtain the mixture, and add it from the main feed port of the twin-screw extruder, and the glass fiber is fed from the side Then, the processing temperature of the twin-screw extruder is controlled to be 200-260°C, and the rotation of the screw is 180-600 rpm, and the mixture is placed in the twin-screw extruder to be extruded and granulated to obtain the product.

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PUM

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Abstract

The invention relates to a polyamide composite material with good tactility and easy encapsulation and a preparation method thereof. The material comprises the following components in parts by weight:25-75 parts of PA6 resin, 15-50 parts of glass fiber, 5-15 parts of styrene copolymer, 2-8 parts of a compatilizer, 3-10 parts of a polar modifier, 0.2-0.5 part of an antioxidant and 0.2-0.5 part ofa dispersant, wherein the polar modifier is a graft copolymer of polyolefin and styrene substances; and during preparation, the other components except the glass fiber are weighed according to the parts by weight and then put into a high-speed mixer for mixing, then the mixture is put into a main feeding port of a double-screw extruder, the glass fiber is added from a side feeding port, and then extrusion and granulation are carried out. The polyamide composite material with good tactility and easy encapsulation, obtained by the preparation method provided by the invention, has the characteristics of good surface tactility, wear resistance, easy encapsulation and the like, and can be widely applied to the fields of electric tools, sports equipment, electronic appliances and the like requiring encapsulation and injection molding.

Description

Technical field [0001] The invention relates to the technical field of polyamide materials, in particular to a polyamide composite material with good touch and easy encapsulation and a preparation method. Background technique [0002] Polyamide has ideal chemical resistance, processability and heat resistance. It is the first of the five engineering plastics, and among them, PA66 and PA6 are the most widely used. Unmodified polyamide has low strength, high water absorption, and poor dimensional stability. Adding a certain amount of inorganic reinforcing materials can significantly improve these properties. The most common is that the addition of glass fiber can significantly improve the mechanical properties of nylon materials. Tools and other engineering parts are widely used, but due to their high hardness and rough surface, they will cause discomfort to human contact friction when they are held for a long time. At present, the common method is to use elastomer secondary overmo...

Claims

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Application Information

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IPC IPC(8): C08L77/02C08L25/12C08L87/00C08L51/06C08L51/00C08K9/06C08K7/14
CPCC08L77/02C08L2205/035C08L25/12C08L87/005C08L51/06C08L51/00C08K9/06C08K7/14
Inventor 徐东东张强陈超王刚郭建鹏
Owner 上海日之升科技有限公司
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