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Detection module and detection method for detecting offset degree of drill hole

A technology for detecting modules and degrees, applied in the direction of multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc., can solve the problem of not necessarily accurately reflecting the whole batch of production boards, and achieve the effect of simple detection methods.

Active Publication Date: 2019-03-26
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Existing methods are only for sampling measurements and do not necessarily accurately reflect the situation of the entire production board

Method used

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  • Detection module and detection method for detecting offset degree of drill hole
  • Detection module and detection method for detecting offset degree of drill hole
  • Detection module and detection method for detecting offset degree of drill hole

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Embodiment

[0030] This embodiment provides a method for manufacturing a circuit board, in which a detection module for detecting the degree of drilling deviation is provided during the production process, and a method for detecting the degree of drilling deviation by using the provided detection module.

[0031] The detection module made on the board in this embodiment is as follows:

[0032] Such as figure 1 As shown, the detection module includes a total of four through hole detection units 20 respectively disposed on the four board edges 10 , and four laser drilling detection units disposed on the board edges 10 .

[0033] via detection unit 20, such as figure 2 As shown, it includes the copper-covered detection area 21 arranged on each circuit layer, the detection pattern arranged in each copper-covered detection area 21, the first metallized through hole 22 (aperture 1.15mm) and a row of six (aperture 1.15mm) mm) of the second metallized through hole 23; the detection pattern is ...

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Abstract

The invention relates to the technical field of circuit board manufacturing and particularly relates to a detection module and detection method for detecting the offset degree of a drill hole. The conduction between a first metallized through hole and a second metallized through hole can be detected only by a multimeter through a set through hole detecting unit, whether the offset degree of the drill hole is in a range accepted by production requirements can be judged, and the offset amount of the drill hole can be calculated according to the diameter of a circular copper-free region corresponding to the second metallized through hole if the first metallized through hole and the second metallized through hole are in conduction. According to the detection module and the detection method, through a set laser drill hole detection unit, whether the offset degree of a laser drill hole is in the range accepted by the production requirements can be judged by using the multimeter to detect theconduction of a pair of metallized blind holes, through the detection method of the invention, the offset degrees of drill holes of a through hole and the laser drill hole on a multi-layer board canbe detected by the multimeter without using an X-ray detector for detection, and the method is simple, convenient and efficient.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a detection module for detecting the degree of drilling deviation and a method for detecting the degree of deviation of the drilling. Background technique [0002] In the production and manufacture of PCB, for multi-layer boards, drilling is an indispensable process. Through the processes of drilling, sinking copper and full-board electroplating, metallization for conducting different circuit layers is made on multi-layer boards. hole. The types of metallized holes used for conduction include blind holes, buried holes, and through holes. Blind holes and buried holes are generally made by laser drilling, and through holes are generally made directly by mechanical drilling. Since the metallized holes are used to conduct the circuit layer, the drilling accuracy has a decisive impact on the quality of the circuit board. If the drilling deviation is large and the acc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638
Inventor 孙保玉莫崇明宋建远彭卫红付强辉
Owner SHENZHEN SUNTAK MULTILAYER PCB
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