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Antireflection technology for bright copper film or copper alloy film

A copper alloy and bright copper technology, applied in the direction of metal material coating process, can solve problems such as affecting the visual effect of users, and achieve the effect of uniform and continuous thickness

Active Publication Date: 2019-04-02
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The copper film or copper alloy film formed by these processes usually has high metallic luster visibility and strong reflectivity, and it is easy to be detected by the naked eye when it is made into a circuit, which affects the user's visual effect

Method used

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  • Antireflection technology for bright copper film or copper alloy film
  • Antireflection technology for bright copper film or copper alloy film
  • Antireflection technology for bright copper film or copper alloy film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment provides a bright copper film anti-reflection process, the process includes the following steps:

[0041](1) Take a copper film test board of about 3cm×5cm, pretreat it with alkaline pretreatment potion for 60s, the treatment temperature is 50°C, and rinse it with deionized water for 1min after the pretreatment;

[0042] (2) Immerse the test panel treated in step (1) in the black oxidation treatment solution for 2 minutes, the treatment temperature is 60°C, after the black oxidation treatment, rinse with tap water and deionized water for 1 minute respectively;

[0043] (3) Immerse the test plate after the treatment in step (2) for 1 min in the corrosion inhibitor solution, the corrosion inhibitor solution is 1mmoL / L benzotriazole (BTA) solution, and the treatment temperature is normal temperature;

[0044] (4) Place the test plate treated in step (3) in an oven, bake at 100°C for 20 minutes, then move it into a desiccator to cool for 10 minutes, and take...

Embodiment 2

[0049] This embodiment provides a bright copper film anti-reflection process, the process includes the following steps:

[0050] (1) Take a copper film test board of about 3cm×5cm, pretreat it with alkaline pretreatment potion for 90s, the treatment temperature is 60°C, and rinse it with deionized water for 1min after the pretreatment;

[0051] (2) Immerse the test plate treated in step (1) in the black oxidation treatment solution for 3 minutes, the treatment temperature is 50°C, after the black oxidation treatment, rinse it with tap water and deionized water for 1 minute respectively;

[0052] (3) Immerse the test plate after the treatment in step (2) for 1 min in the corrosion-inhibiting potion, the corrosion-inhibiting potion is 1mmoL / L tolyltriazole (TTA) solution, and the treatment temperature is normal temperature;

[0053] (4) Place the test plate treated in step (3) in an oven, bake it at 150° C. for 10 minutes, then move it into a desiccator to cool for 10 minutes, a...

Embodiment 3

[0058] This embodiment provides a bright copper film anti-reflection process, the process includes the following steps:

[0059] (1) Take a copper film test board of about 3cm×5cm, pretreat it with alkaline pretreatment potion for 3 minutes, and the treatment temperature is 45°C, and rinse it with deionized water for 1 minute after the pretreatment;

[0060] (2) Immerse the test plate treated in step (1) in the black oxidation treatment solution for 0.5 min, the treatment temperature is 60°C, after the black oxidation treatment, rinse with tap water and deionized water for 1 min respectively;

[0061] (3) Immerse the test plate treated in step (2) in the corrosion inhibitor solution for 2 minutes, the corrosion inhibitor solution is 0.5mmoL / L TTA solution, and the treatment temperature is 50°C;

[0062] (4) Place the test plate treated in step (3) in an oven, bake at 200°C for 0.5 min, then move it into a desiccator to cool for 10 min, and take it out for observation and testi...

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Abstract

The invention relates to an antireflection technology for a bright copper film or copper alloy film. The technology comprises the steps that the bright copper film or the copper alloy film are subjected to black oxidation treatment at the temperature of 40-60 DEG C for 0.5-5min and dried after treatment, and the reflectivity of the copper film or copper alloy film is reduced; the thickness of thebright copper film or copper alloy film is 0.1-1 micrometer, and the reflectivity is larger than 30% within the wavelength of 380-780nm. By preparing a reagent and optimizing technological conditions,the thickness of a copper oxide layer is precisely controlled. On the premise of ensuring that electrical conductivity of the copper film or copper alloy film meets requirements, the reflectivity isgreatly reduced, the average reflectivity of the copper film or copper alloy film within the wavelength range o 380-780 nm is reduced to 15% or below, and the application prospect is good.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a bright copper film or copper alloy film anti-reflection process. Background technique [0002] Copper and copper alloys are metal materials with good conductivity and low cost, and are the most important conductive substances on circuit boards, display screens and other devices. One of the main purposes of black oxidation treatment of copper and its alloys in the prior art is to form a protective layer on the metal surface to prevent copper and its alloy parts from being exposed to H in the atmosphere. 2 S, SO 2 The second main purpose is to form a blackened layer with suitable roughness on the copper surface of the inner layer copper of the multilayer circuit board to strengthen the copper surface. The bonding force between the surface and the prepreg. [0003] In practical applications, the thickness of copper or copper alloy treated by the existing black oxidati...

Claims

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Application Information

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IPC IPC(8): C23C22/73C23C22/78
CPCC23C22/73C23C22/78
Inventor 李晓红明东远章晓冬黄叔房刘江波
Owner GUANGDONG SKYCHEM TECH LTD
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