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Preparation method of antireflection oxide surface

An oxide and anti-reflection technology, which is applied in the direction of final product manufacturing, sustainable manufacturing/processing, solid-state diffusion coating, etc., can solve the problems of complicated and harsh manufacturing process, great impact on the anti-reflection effect of the film layer, and low value , to achieve the effects of improving measurement accuracy, excellent anti-reflection performance, and uniform and continuous thickness

Pending Publication Date: 2022-08-05
CHANGCHUN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In practical applications, the existing anti-reflection coating materials mainly include nickel-phosphorus alloys and carbon nanotubes. The manufacturing process is complex and harsh, and the thickness of the coating layer has a great impact on the anti-reflection effect, so it is of low value in practical applications.

Method used

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  • Preparation method of antireflection oxide surface
  • Preparation method of antireflection oxide surface
  • Preparation method of antireflection oxide surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] (1) Take a piece of bright copper sheet with a size of about 10mmх10mm, treat it with a pretreatment cleaning agent for 10min, the treatment temperature is 20℃, and rinse it with deionized water for 1min after the pretreatment;

[0040] (2) at 20-30° C., use 2000-mesh sandpaper to polish the copper sheet pretreated in step (1);

[0041] (3) Weigh 7.5g of ferric chloride, pour it into 50ml of deionized water and stir until it is completely dissolved, then add 3ml of hydrochloric acid and 100ml of deionized water in turn, after the etching solution is successfully prepared, soak it at 20-50°C Or spray the polished copper sheet in step (2) for 10-60min etching treatment in liquid medicine, and then wash it with water;

[0042] (4) The copper sheet processed in step (3) was placed in a corundum boat, placed in a muffle furnace, thermally oxidized at 500° C. for 120 min, cooled in the furnace after the treatment, and taken out for observation and testing.

[0043] like Fi...

Embodiment 2

[0046] (1) Take a bright copper sheet with a size of about 10mmх10mm, treat it with a pretreatment cleaning agent for 10min, the treatment temperature is 20℃, and rinse it with deionized water for 1min after the pretreatment;

[0047] (2) at 20-30° C., use 2000-mesh sandpaper to polish the copper sheet pretreated in step (1);

[0048] (3) Weigh 7.5g of ferric chloride, pour it into 50ml of deionized water and stir until it is completely dissolved, then add 3ml of hydrochloric acid and 100ml of deionized water in turn, after the etching solution is successfully prepared, soak it at 20-50°C Or spray the polished copper sheet in step (2) for 10-60min etching treatment in liquid medicine, and then wash it with water;

[0049] (4) The copper sheet processed in step (3) was placed in a corundum boat, placed in a muffle furnace, thermally oxidized at 500° C. for 60 min, cooled in the furnace after the treatment, and taken out for observation and testing.

[0050] like Figure 5 As ...

Embodiment 3

[0053] (1) Take a bright copper sheet with a size of about 10mmх10mm, treat it with a pretreatment cleaning agent for 10min, the treatment temperature is 20℃, and rinse it with deionized water for 1min after the pretreatment;

[0054] (2) at 20-30° C., use 2000-mesh sandpaper to polish the copper sheet pretreated in step (1);

[0055] (3) Weigh 7.5g of ferric chloride, pour it into 50ml of deionized water and stir until it is completely dissolved, then add 3ml of hydrochloric acid and 100ml of deionized water in turn, after the etching solution is successfully prepared, soak it at 20-50°C Or spray the polished copper sheet in step (2) for 10-60min etching treatment in liquid medicine, and then wash it with water;

[0056] (4) The copper sheet processed in step (3) was placed in a corundum boat, placed in a muffle furnace, thermally oxidized at 450° C. for 180 min, cooled in the furnace after the treatment, and taken out for observation and testing.

[0057] like Figure 5 As...

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Abstract

The invention discloses a preparation method of an antireflection oxide surface, which comprises the following steps of: S1, carrying out etching treatment on the surface of a metal base material to form a micro-nano structure on the surface of the metal base material; s2, performing thermal oxidation treatment on the metal base material with the micro-nano structure surface treated in the step S1 to form a layer of oxide nanowires on the surface of the metal base material so as to obtain the antireflection oxide surface; wherein the thermal oxidation treatment temperature ranges from 300 DEG C to 600 DEG C, and the thermal oxidation treatment time ranges from 100 min to 300 min. The invention also provides an antireflection oxide surface prepared by the method. According to the preparation method of the antireflection oxide surface, on the premise that the preparation process of an antireflection film layer material is simplified, the reflectivity of the antireflection film layer material is greatly reduced, and a super-hydrophobic structure is formed on the surface of the antireflection film layer material.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a preparation method of an anti-reflection oxide surface. Background technique [0002] As a metal material with excellent ductility, conductivity and low cost, copper has a wide range of applications in functional materials such as photothermal conversion and light absorption. One of the main purposes of preparing copper oxide nanostructures on copper surfaces in the prior art is to form a film layer on the metal surface. When light is incident on the array, it will produce a "light trapping effect" with the nanostructures in the array. Perform multiple reflection and absorption to reduce the amount of light reflected from the array; the second main purpose is that the copper oxide nanowire array can form a micro-nano structure, and a Cassie model is formed on its surface. There is a lot of air between the rough structures, so that the surface will not Wetted by the d...

Claims

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Application Information

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IPC IPC(8): C23C8/02C23C8/10C23F1/18G02B1/11B82Y40/00
CPCC23C8/02C23C8/10C23F1/18G02B1/11B82Y40/00Y02P70/50
Inventor 王燕王延君李玥王东卿高亚鹏
Owner CHANGCHUN UNIV OF TECH
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