Quick measuring method of bivalent copper ion in copper plating bath
A rapid determination technology of divalent copper ions, which is applied in chemical analysis by titration, analysis by making materials undergo chemical reactions, and material analysis by observing the influence on chemical indicators, etc., can solve the problems of test practicability and Difficult to achieve cost performance, expensive equipment, cumbersome pre-treatment and other problems, to achieve the effect of ensuring the quality of copper plating, short cycle and simple test process
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[0038] The present invention will be further described in detail below through the specific examples, the following examples are only descriptive, not restrictive, and cannot limit the protection scope of the present invention with this.
[0039] A method for quickly measuring divalent copper ions in a copper plating solution, the innovation of the present invention is that it comprises the following steps:
[0040] Step 1: Use PAN as the indicator, adjust the test solution to be weakly acidic with the buffer solution, and use the coordination titration method to titrate with the EDTA standard solution until the solution is yellow-green. 2+ 、Cu 2+ After the reaction is complete, continue to drop 1-2 drops of EDTA standard solution. Excess EDTA reacts with PAN, and the solution turns yellow-green, which is the equivalent point of the reaction. According to the consumed volume and concentration of EDTA standard solution, calculate Cu 2+ and Fe 2+ total content;
[0041] Step 2:...
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