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PCB manufacturing method for avoiding plugging holes or poor plating holes

A production method and poor technology, applied in the direction of cleaning method, cleaning method and utensils, chemical instruments and methods using gas flow, etc., can solve the problems such as difficulty in ensuring the effect of hole plating, achieve the effect of ensuring the effect of plating holes, reduce production costs, The effect of reducing difficulty

Inactive Publication Date: 2019-04-05
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that there is dust / foreign matter plugging holes in the existing PCB manufacturing method, which makes it difficult to ensure the electroplating effect of the holes, and provides a method for the production of PCBs that can ensure the effect of plating holes by optimizing the process flow and prevent plugged holes or poor plating holes. method

Method used

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Embodiment

[0022] This embodiment provides a PCB manufacturing method for preventing plugged holes or defective plated holes. The metallized holes on the PCB prepared in this embodiment have a minimum diameter of 0.35mm and an aspect ratio of 4.2:1.

[0023] (1) Cutting: cut out the inner core board according to the panel size required by the design.

[0024] (2) Making the inner layer circuit: using the negative process to make the inner layer circuit on the inner layer core board to obtain the inner layer circuit board. Among them, the inner layer graphics: dry / wet film process wet film, the number of PP on the lower side is 2, the residual copper rate on the lower side is 85%, the type of PP on the lower side is 1080H, and the residual copper rate on the upper side is 69%; inner layer etching: Ordinary line width tolerance is ±20%, the minimum line width of l4s finished products is 0.203mm, the minimum clearance of l5s finished products is 0.16mm, and the minimum clearance of l4s fini...

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Abstract

The invention relates to the technical field of circuit board production, in particular to a PCB manufacturing method for avoiding plugging holes or poor plating holes. The PCB manufacturing method can effectively clean the foreign matters such as dust or resin in a hole by optimizing process parameters of the grinding board water washing step of the copper board electric process to significantlyimprove the cleaning effect on the production board, solve the problem of plugging of foreign matters such as dust and provide necessary guarantee for the subsequent copper deposition and electroplating for metallization of the hole and formation of a good metal layer at the hole wall. The hole wall is high in cleanness to facilitate prevent the hole wall from generating copper deposition bubblesso as to obtain a good hole plating effect. The process parameters in the whole board electroplating link in the copper board electric process and the electrocoppering link in the outer layer graph electroplating process are optimized to further ensure the plating hole effect. In the drilling process of the outer layer drilling process, a certain-pressure dust absorption device can timely and effectively take away the dust generated by drilling to reduce the problem of plugging by the dust and allow the grinding board water washing link to be easier clean the hole.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a PCB manufacturing method for preventing plugged holes or defective plated holes. Background technique [0002] In the production process of circuit boards (PCB), there are often cases of dust or other foreign matter blocking the non-metallized holes, which will lead to poor plating of the metallized holes formed after these non-metallized holes are metallized There are even some holes without copper in the whole hole, which leads to scrapping, and the problem of poor plating holes causes great hidden dangers to the quality of the product. Especially for small-sized (small-diameter) holes, the problem of poor plating caused by dust or other foreign matter plugging the hole is more serious. The foreign matter in the hole is washed clean, and it is difficult to guarantee the plating effect of small-sized holes. Common defects in plugged holes and plated holes in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26H05K3/02H05K3/00B08B5/04
CPCB08B5/04H05K3/0047H05K3/022H05K3/26
Inventor 孙保玉彭卫红宋建远徐正
Owner SHENZHEN SUNTAK MULTILAYER PCB
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