A kind of preparation device of copper clad board
A technology for preparing devices and copper clad laminates, applied in the directions of lamination devices, printed circuit manufacturing, adhesive types, etc. Problems such as easy peeling at the junction of both sides of the foil plate to prevent displacement
Active Publication Date: 2019-09-13
GUANGDONG FINE YUAN SCI TECH CO LTD
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Problems solved by technology
[0002] During the preparation process of copper clad board, the insulating material and colloidal copper foil are directly compounded, but a slight deviation in the compounding process will easily cause the position of the insulating material and colloidal copper foil to shift, which will cause local bulges and incomplete coverage, which will affect the copper clad. The quality of the foil board, at the same time, the joints of the two sides of the laminated copper clad board are easy to peel off
Method used
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Embodiment 1
[0025] A preparation device for a copper clad board, through which the adhesive surface of the colloidal copper foil is pressed against the glass cloth to obtain a copper clad board, such as figure 1 , figure 2 , image 3 , Figure 4 As shown, the device includes a frame 1, and two oppositely arranged first support plates 11 are installed on one side of the surface of the frame 1, and a position adjustment mechanism 2 is installed and fixed between the two first support plates 11, while the frame 1, two opposite second support plates 12 are vertically installed and fixed on both sides of the middle part of the surface, a first top plate 121 is vertically connected and fixed between the tops of the two second support plates 12, and a bottom plate is vertically connected and fixed between the bottom ends of the two second support plates 12 122, a first adjusting screw 3 is installed on the first top plate 121, and a pressing mechanism 4 is slidably installed and fixed between...
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The invention discloses a colloidal copper foil applicable to preparing copper-clad plates. The colloidal copper foil applicable to preparing the copper-clad plates comprise an electrolytic copper foil layer, and the rough surface of the electrolytic copper foil layer is coated with a layer of compound adhesives. According to the colloidal copper foil applicable to preparing the copper-clad plates, bisphenol A is modified so that every modified bisphenol A monomer contains three fluorine elements and one cyano group, so that polymers prepared through crosslinking contain a large quantity of fluorine elements and cyano groups; As strong electro-withdrawing groups, the cyano groups introduced into a molecular structure can strengthen the structural rigidity of the polymers and limit the movement ability by improving the rotating energy barriers of molecular chains and further increase the glass transition temperature as well as heat resistance of epoxy resin; meanwhile, interaction between the cyano groups can produce crosslinking reaction to greatly improve the thermal stability and mechanical performance of a system.
Description
technical field [0001] The invention belongs to the field of copper foil preparation and relates to a preparation device for a copper clad board. Background technique [0002] During the preparation process of copper clad board, the insulating material and colloidal copper foil are directly compounded, but a slight deviation in the compounding process will easily cause the position of the insulating material and colloidal copper foil to shift, which will cause local bulges and incomplete coverage, which will affect the copper clad. The quality of the foil board, at the same time, the joints of the two sides of the laminated copper clad board are easy to peel off. Contents of the invention [0003] The purpose of the present invention is to provide a high temperature and aging resistant glued copper foil and its application in the preparation of copper clad laminates. The present invention sets a pressing structure on the homogeneous laminating machine, through the first ad...
Claims
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IPC IPC(8): B32B37/10B32B37/12B32B38/18C09J163/00H05K3/02
CPCC08G59/28C08G59/308C09J163/00
Inventor 叶敬敏王俊锋温丙台郑衍年刘焕添郭志航叶冬萌
Owner GUANGDONG FINE YUAN SCI TECH CO LTD