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Heat dissipation device for upper platform of stamping machine

A heat dissipation device and bronzing machine technology, which is applied to printing machines, rotary printing machines, printing, etc., can solve problems such as insufficient heat dissipation efficiency, expansion exceeding precision requirements, and large size.

Pending Publication Date: 2019-04-12
MASTERWORK GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For large-format machines, the thermal expansion of the upper platform will also increase accordingly. The thermal insulation board with a flat plate shape will cause the expansion to exceed the precision requirements due to insufficient heat dissipation efficiency.

Method used

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  • Heat dissipation device for upper platform of stamping machine
  • Heat dissipation device for upper platform of stamping machine

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Embodiment Construction

[0019] Figure 1-2 and the following description describe alternative embodiments of the invention to teach those skilled in the art how to make and reproduce the invention. In order to teach the technical solutions of the present invention, some conventional aspects have been simplified or omitted. Those skilled in the art should understand that modifications or substitutions from these embodiments will fall within the protection scope of the present invention. Those skilled in the art will appreciate that the features described below can be combined in various ways to form multiple variations of the invention. As such, the invention is not limited to the alternative embodiments described below, but only by the claims and their equivalents.

[0020] figure 1 Shows a schematic perspective view of the three-dimensional structure of the heat sink on the platform of the hot stamping machine according to an embodiment of the present invention, the heat sink on the platform of t...

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Abstract

The invention provides a heat dissipation device for an upper platform of a stamping machine. The heat dissipation device for the upper platform of the stamping machine comprises a main body, a firstconnecting plate and a second connecting plate; the main body comprises a heating assembly, a heat dissipation assembly and an upper platform, the heat dissipation assembly is formed by combining a plurality of heat dissipation components, heat dissipation units are provided with air grooves, the heating assembly and the heat dissipation assembly are both rectangular, the heat dissipation assemblyis arranged above the heating assembly, the upper platform is installed above the heat dissipation assembly, and the first connecting plate and the second connecting plate are installed on the two opposite sides of the main body respectively. The heat dissipation device has the advantages that the heat dissipation assembly is composed of a plurality of independent heat dissipation components, sothat the overall thermal expansion amount is reduced; and the heat dissipation efficiency is improved by ventilating the air grooves in a heat dissipation plate, so that the requirement for the heat expansion of a large-format gold stamping equipment can be better met.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for an upper platform of a bronzing machine. Background technique [0002] With the rapid development of the printing and packaging industry, the market has higher and higher requirements for the automation of post-press processing equipment. The pursuit of high-speed and precise processing equipment to improve production efficiency and occupy the market is the market demand and the development of post-press equipment. trend. The hot stamping machine needs to heat the gold foil during the hot stamping process, and the heated gold foil is firmly printed on the paper to complete the hot stamping. The heating device is installed on the upper platform of the machine. Heat will be generated during the heating process, and the heat will be conducted to the upper platform to cause thermal expansion of the upper platform. The thermal expansion of the upper platform ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F19/06
CPCB41F19/06
Inventor 戴志辉首云飞吕永娜
Owner MASTERWORK GROUP CO LTD