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Steel plate release agent for pcb multilayer board lamination process

A multi-layer board and release agent technology, applied in the direction of coating, etc., can solve the problems that the edges of the steel plate cannot be covered, the edges cannot be released, and the pressing is difficult to complete, so as to improve product yield, good release effect, The effect of little environmental pollution

Active Publication Date: 2021-02-19
KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has certain disadvantages, such as the need to match the size of the steel plate, the edge of the steel plate cannot be covered and the edge cannot be released, the pressing is difficult to remove from the plate surface, and the cost is high.

Method used

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  • Steel plate release agent for pcb multilayer board lamination process
  • Steel plate release agent for pcb multilayer board lamination process
  • Steel plate release agent for pcb multilayer board lamination process

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Embodiment Construction

[0014] In order to be able to understand the technical means of the present invention more clearly and implement it according to the contents of the description, the specific embodiments of the present invention will be further described in detail below in conjunction with specific examples. The following examples are used to illustrate the present invention, but not to limit it scope of the invention.

[0015] Carry out the preparation of specific examples and comparative examples according to the formula described in specific examples and comparative examples in table 1 with the following method: accurately weigh polyquaternium salt, siloxane and polyolefin wax emulsion, and the above-mentioned weighed After each component is added into deionized water one by one, mechanical stirring is carried out at normal temperature until each component is uniformly dissolved in deionized water, and a steel plate release agent for PCB multilayer board lamination process is obtained. The ...

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Abstract

The invention discloses a steel plate release agent used in the lamination process of PCB multilayer boards. The release agent is in the form of pure liquid and consists of polyquaternium 1-7wt.% and siloxane 1.0-5.0wt.%. , Polyolefin wax emulsion 2‑10wt.% and the balance of deionized water are evenly mixed and prepared. When using, just soak the pressed steel plate in the release agent, take it out and dry it, and a layer can be formed on the surface of the steel plate Uniform solid release layer, which can effectively block the direct contact between the resin and the steel plate, has a good release effect, reduces the residue of resin particles, reduces the proportion of lamination depressions, and can improve the product yield of the lamination process; and the end of use Afterwards, it is convenient to remove by brushing and grinding, and no resin particles will remain. After filtering, the used waste liquid can be treated according to general waste water, and the environmental pollution is small.

Description

technical field [0001] The invention relates to a release agent, in particular to a steel plate release agent used in a PCB lamination process, and belongs to the technical field of additives for the PCB lamination process. Background technique [0002] The Chinese name of PCB (Printed Circuit Board) is a printed circuit board, also known as a printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. As the requirements for information transmission become higher and higher, the number of layers of PCB multilayer circuit boards is also increasing. The lamination involved in the production process of PCB multilayer boards is to use high temperature and high pressure to heat and melt the resin prepreg, make it flow, and then heat-cure it into a cured sheet, so that one or more inner layers are etched. Blackening or browning treatment) and copper foil are bonded into a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D183/04C09D183/07C09D179/02C09D123/06C09D187/00
CPCC08L2205/035C09D123/06C09D123/12C09D179/02C09D183/04C08L79/02C08L23/06C08L87/005C08L83/04
Inventor 王立中黄志齐陈修宁黄京华王淑萍李晨庆
Owner KUNSHAN CITY BANMING ELECTRONICS SCI & TECH