Vacuum evaporation device and vacuum evaporation method
An evaporation and vacuum technology, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of reduced evaporation yield and poor adsorption effect of metal masks.
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[0044] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0045] During the use of the vacuum evaporation device in the prior art, the magnetic plate used is generally a whole magnetic plate. During the adsorption process between the magnetic plate and the metal mask, due to the substrate placed above the metal mask Due to the gravity of the substrate itself, the substrate substrate sags and presses down on the metal mask. This situation will easily cause the central area of the metal mask to sag, which will cause the surrounding edges of the metal mask to be closer to ...
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