Chip surface-mounting identification system and method

Abstract

The invention relates to the technical field of optical communication, and provides a chip surface-mounting identifying system and method. The system comprises a shooting device, a substrate and an absorption device, wherein the shooting device is arranged on the substrate, the substrate is used for surface-mounting a chip, the absorption device is used for absorbing the chip and moving the chip to a part below the shooting device, the shooting device is used for identifying a position of the substrate and a position of the chip by shooting, an identification region is arranged on a surface ofthe chip, and the identification region is exposed when the absorption device absorbs the chip so that the chip is moved to the part below the shooting device, and the shooting device is used for identifying the position of the chip by shooting the identification region. By the system, the identification region of the surface can be exposed when the chip is absorbed by using the special absorption device; identification and positioning of the chip and the substrate are completed by a camera, the system cost is low, the influence of an installation error of different cameras on surface-mounting accuracy is eliminated, moreover, the chip position is identified after the chip is absorbed, and the surface-mounting accuracy and the surface-mounting efficiency are improved.

Description

【Technical field】 [0001] The invention relates to the technical field of optical communication, and provides a chip mounting identification system and method. 【Background technique】 [0002] The optical module is a kind of communication module that can complete the mutual conversion function of photoelectric signals. With the advent of the era of big data, the demand for optical modules for data communication is becoming more and more strong. The optical module is mainly composed of two parts: the circuit part and the optical path part. The circuit part is mainly used for the processing and transmission of electrical signals, and the optical path part is mainly responsible for the transmission of optical signals. During the production process of the optical module, the optical components related to the optical path are aligned. The process is more important, called optical path coupling or optical component coupling. With the improvement of integration density, more and mor...

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Problems solved by technology

However, by setting up two cameras for position recognition, the system is more complicated, and the relative position between the two cameras will also cause a certain recognition error. When the relative position of the two cameras fluctuates, the mounting accuracy will be affected; On the other hand, the identification of the chip position may change to a certain extent after the chip is picked up by the suction head before the chip is picked up, that is, there may be a certain position deviation before and after the chip is picked up, and the chip moves with the suction head. During the process, the position deviation of the chip relative to the suction head cannot be eliminated, and it will also affect the placement accuracy. Moreover, since the stroke from the chip position recognition to the chip transfer to the substrate for placement is relatively long, in order to reduce air resistance. Influenced by chip absorption stability, the movement speed of the welding head during the entire stroke should not be too fast, which will affect the placement efficiency

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