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Substrate material fixing device and fixing method

A technology for substrate materials and fixtures, applied in semiconductor/solid-state device manufacturing, sustainable manufacturing/processing, electrical components, etc., can solve problems such as uneven heating, and achieve the effect of increasing the usable area

Inactive Publication Date: 2019-04-12
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Embodiments of the present invention provide a substrate material fixing device and fixing method to solve the problem of uneven heating of the substrate material existing in the prior art

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  • Substrate material fixing device and fixing method
  • Substrate material fixing device and fixing method

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Embodiment Construction

[0030] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0031] What the present invention is to provide is a substrate material fixing device and fixing method. In order to avoid the temperature uniformity problem caused by the different contact conditions between the substrate material reference edge and the metal support reference edge due to tolerance and rotation problems, the metal support Both the inner ring and the substrate material are set in the shape of a perfect circle, and t...

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Abstract

The invention discloses a substrate material fixing device and fixing method, and relates to the technical field of a thin film epitaxial process. The fixing device comprises a metal support, whereina circular-shaped first metal step is arranged in the center of the metal support, a substrate material is in a right round shape, and the first metal step is used for placing the substrate material.The method comprises the steps of placing the metal support and the substrate material in a hand box for operation; placing the substrate material on the first metal step of the metal support to obtain a substrate fixing device on a to-be-sealed state; placing a metal press ring on a second metal step of the substrate fixing device in the to-be-sealed state to obtain the substrate fixing device ina sealed state; and assembling the substrate fixing device in the sealed state in molecule epitaxial equipment for use. With the adoption of the method, the constituent standard difference and the thickness standard difference of an HgCdTe material both are improved by one order of magnitude under the conditions of same equipment and same process.

Description

technical field [0001] The invention relates to the technical field of thin film epitaxy, in particular to a substrate material fixing device for improving temperature uniformity used in the process of epitaxy of mercury cadmium telluride on a large-area substrate using a molecular beam epitaxy method in the field of infrared focal planes and fixed method. Background technique [0002] With the development of infrared focal plane detectors towards the third-generation focal plane with the main characteristics of large area array and double multi-color, its application in aerospace and other fields has shown explosive growth in recent years; especially in meteorological observation in the field of spaceborne applications. , the demand for large area array high-end devices is urgent and diverse, which puts forward extremely high requirements for the performance indicators such as blind cell rate and non-uniformity of the device, and then requires the materials for preparing in...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01L31/18
CPCH01L21/68735H01L21/68785H01L31/1832Y02P70/50
Inventor 王经纬王丛刘铭巩锋高达周立庆
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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