Diffusion Barriers in Metal Superconducting Wires

Abstract

In various embodiments, the superconducting wire includes a diffusion barrier composed of a Ta alloy, which resists internal diffusion and provides the wire with superior mechanical strength.

Description

[0001] related application [0002] This application claims the benefit of and priority to U.S. Provisional Patent Application No. 62 / 383,676, filed September 6, 2016, the entire disclosure of which is incorporated herein by reference. technical field [0003] In various embodiments, the present invention relates to the formation and processing of superconducting wires that include diffusion barriers to prevent low-conductivity phases. Background technique [0004] Superconducting materials exhibit no electrical resistance when cooled below their characteristic critical temperature. Although high-temperature superconductor materials with critical temperatures higher than the 77K boiling point of nitrogen have been identified, these materials are often idiosyncratic (e.g., perovskite ceramics), difficult to process, and unsuitable for high-field applications. Therefore, for practical superconducting applications requiring wires and coils of wire and their bundles, the metal...

AI Technical Summary

Problems solved by technology

Unfortunately, various elements from the superconducting wire (e.g., Sn) may react with part of the Cu stabilizer to form a low-conductivity phase that negatively affects the overall conductivity of the entire wire

Although diffusion barriers have been utilized to protect Cu stabilizers from superconducting filaments, these barriers tend to have non-uniform cross-sectional areas and may even be damaged due to non-uniform deformation during co-processing of diffusion barriers and Cu stabilizers. partial rupture

Although it is possible to simply make this diffusion barrier thicker, this solution affects the overall conductivity of the wire due to the inherently low conductivity of the diffusion barrier material

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