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Diamond wire saw based on nickel alloy core wire

A diamond wire saw, nickel alloy technology, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problems of uneven cutting edge, damaged sharpness, etc. The effect of sufficient hardness

Inactive Publication Date: 2019-04-23
镇江笑宁能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the production and processing of diamond wire saws, it is easy to produce uneven cutting edges and damage the sharpness during use.

Method used

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Experimental program
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Effect test

Embodiment Construction

[0015] The present invention is a technical solution adopted by the present invention: a diamond wire saw based on a nickel alloy core wire, characterized in that the diamond wire saw includes a metal core wire inner core, a diamond abrasive grain middle layer and a coating outer layer; The thickness of the middle layer of diamond abrasive grains is uniform, and its thickness is less than or equal to 70 μm; greater than 30 μm;

[0016] The inner core is a nickel alloy core wire, including tungsten with a mass ratio of 30%; the outer layer of the coating is a metal coating; the metal coating includes Ti and Al;

[0017] The coverage of the diamond abrasive grains on the inner core of the metal core is 28%-40%.

[0018] Further, the average particle size of the diamond abrasive grains is 2 μm˜61 μm.

[0019] Further, the nickel alloy core wire includes tungsten, and the mass percentage of tungsten is 55%-62%.

[0020] Further, the diamond wire saw is manufactured by electropla...

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PUM

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Abstract

The invention discloses a diamond wire saw based on a nickel alloy core wire. The diamond wire saw is characterized in that the diamond wire saw comprises a metal core wire inner core, a diamond abrasive particle middle layer and a coverage film outer layer. The diamond abrasive particle middle layer is uniform in thickness, and the thickness of the diamond abrasive particle middle layer is less than or equal to 70 microns and greater than 30 microns. The inner core is the nickel alloy core wire and comprises, by mass percentage, 30% of tungsten. The coverage film outer layer is a metal coverage film. The metal coverage film comprises Ti and Al. The coverage rate, on the metal core wire inner core, of the diamond abrasive particle middle layer is 28-40%. The metal coverage film is added, the alloy matching rate is adjusted, so that the sharpness of the wire saw is fully maintained, and the wire saw is not likely to be damaged; and by means of the nickel alloy core wire, the whole wiresaw can achieve the full hardness.

Description

technical field [0001] The invention relates to a diamond wire saw, in particular to a diamond wire saw based on a nickel alloy core wire. Background technique [0002] Diamond wire saw, also known as diamond wire, refers to the use of electroplating process or resin bonding method to fix diamond abrasive on the wire. [0003] In the 1990s, in order to solve the processing problem of large-size silicon wafers internationally, wire saw processing technology was used to cut silicon rods into pieces. The early wire saw processing technology used bare metal wires and free abrasives. During the processing, the abrasives were added as a third party between the metal wire and the workpiece to produce cutting action. This technique has been successfully used in the processing of silicon and silicon carbide. In order to further shorten the processing time, and to process other hard substances and ceramics that are difficult to process, people fix diamond abrasives on metal wires in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
CPCB28D5/042
Inventor 陈庆
Owner 镇江笑宁能源科技有限公司
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