Silicon chip identification method

A technology for silicon wafers and silicon wafer boxes, applied in the field of silicon wafer identification, can solve problems such as inconvenience, and achieve the effects of improving utilization, reducing the risk of errors, and reducing usage

Active Publication Date: 2019-04-23
上海微阱电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the existing solution, a variety of silicon wafer boxes are needed, and it will bring great inconvenience during the process of silicon wafer slicing

Method used

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  • Silicon chip identification method
  • Silicon chip identification method

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Embodiment Construction

[0031] The core idea of ​​the present invention is that the present invention provides a silicon chip identification method, comprising the following steps:

[0032] Step S01: Using a silicon wafer box, after the silicon wafers are picked and placed, scan the ID information of the silicon wafers to be identified at each slot position in the silicon wafer box to obtain the IDs of all the silicon wafers to be identified in the silicon wafer box information;

[0033] Step S02: Transfer the ID information of the silicon wafer to be identified to the manufacturing execution system;

[0034] Step S03: comparing the ID information of the silicon wafer to be identified by the manufacturing execution system to confirm the type of the silicon wafer to be identified. May also include:

[0035] Step S04: Through the manufacturing execution system, the ID information of the silicon wafer to be identified after the type is confirmed is transmitted in real time to the equipment that needs ...

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PUM

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Abstract

The invention discloses a silicon chip identification method, which comprises the following steps of S01, using a silicon chip box; after silicon chip taking and placement is completed, scanning ID information of silicon chips to be identified on each groove position in the silicon chip box; obtaining the ID information of all silicon chips to be identified in the silicon chip box; S02, transmitting the ID information of the silicon chips to be identified to a manufacturing execution system; S03, comparing the ID information of the silicon chips to be identified by the manufacturing executionsystem; confirming the types of the silicon chips to be identified. The silicon chip identification method has the advantages that the types of the used silicon chip boxes can be reduced; the utilization rate of the silicon chip box is improved; the complexity of the relevant silicon chip separation process is reduced; the error making risk is reduced; the production efficiency is improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor integrated circuit equipment, and more specifically, to a silicon wafer identification method. Background technique [0002] In the manufacture of semiconductor integrated circuits, the degree of automation is getting higher and higher. In the production and processing of 200mm and 300mm silicon wafers, SMIF POD (for 200mm) and FOUP (for 300mm) silicon wafer boxes are commonly used to load the silicon to be processed. piece. [0003] In the process of silicon wafer processing, before the silicon wafers are sent to the process equipment for processing, it is necessary to scan and map the silicon wafers in the silicon wafer box to confirm the number of silicon wafers in the silicon wafer box and the location of each piece. The position and whether there are errors such as lamination and oblique placement, so as to avoid mistakes in the process of processing and transferring films. ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/673G06K9/32
CPCH01L21/67294H01L21/6732G06V20/62G06V30/10
Inventor 李佳青
Owner 上海微阱电子科技有限公司
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