Method and device for preparing flexible conductive circuit by electrospinning and chemical deposition technology
A technology of chemical deposition and electrospinning, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of poor flexibility, flexible conductive line width control, etc., and achieve simple preparation process, good flexibility, and large jet drive force effect
Active Publication Date: 2022-03-25
XI'AN POLYTECHNIC UNIVERSITY
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Problems solved by technology
[0003] The purpose of the present invention is to provide a method for preparing flexible conductive lines by electrospinning and chemical deposition technology, which solves the problems of limited line width and poor flexibility in the preparation of flexible conductive lines by existing methods
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[0025] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0026] The present invention relates to an electro-fluid driven double-nozzle droplet spraying device, the structure of which is as follows: figure 1 As shown, it includes a two-dimensional moving platform 9, a flexible substrate 8 is installed on the two-dimensional moving platform 9, a CCD camera 7 is arranged on the side of the two-dimensional moving platform 9, and a spray head A4 and a spray head B5 are arranged above the two-dimensional moving platform 9. The spray head A4 and the nozzle B5 are connected to the driving power source 2 through the wire. The nozzle A4 and the nozzle B5 are respectively connected to the micro air pump A3 and the micro air pump B6 through the air pipe. The driving power source 2, the two-dimensional mobile platform 9, the CCD camera 7, the micro air pump A3 and the micro air pump The air pumps B6 are all conne...
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Abstract
The invention discloses a method for preparing a flexible conductive circuit by electrospinning and chemical deposition technology, which is based on an electrofluid-driven double-nozzle droplet ejection device, including a two-dimensional mobile platform installed with a flexible substrate, a CCD camera is arranged on its side, and a CCD camera is arranged above it. There are Nozzle A and Nozzle B, Nozzle A and Nozzle B are connected to drive power through wires, and are also connected to micro air pump A and micro air pump B through air guide tubes, drive power, two-dimensional mobile platform, CCD camera, micro air pump A and micro air pump The air pumps B are all connected to the control equipment; the device of the present invention controls the spraying of the ascorbic acid solution and the silver nitrate solution successively, and deposits them according to the same track, and the two kinds of micro-droplets react chemically and deposit metallic silver to form a flexible conductive circuit. The conductive circuit prepared by the method of the invention is not limited by the base material and shape, has simple operation and high controllability, and can also prepare cross-scale flexible conductive circuits of several micrometers to hundreds of micrometers.
Description
technical field [0001] The invention belongs to the technical field of flexible conductive circuit preparation, and relates to a method for preparing flexible conductive circuits by electrospinning and chemical deposition technology. Background technique [0002] The current methods of fabricating conductive lines on flexible substrates are generally divided into: implantation, screen printing and droplet jetting. (1) Implantable, mainly by implanting conductive fibers into the fabric by means of embroidery, sewing, weaving, weaving, etc. to form conductive circuits; but the conductive fibers are easily bent during the implantation process. In order to avoid the above problems, The conductive yarns in the fabric must have high strength and elasticity, which not only increases the cost and difficulty of manufacturing conductive fibers, but also the formed fabric is too stiff, heavy, and difficult to bend. (2) Screen printing technology, which mainly uses conductive paste to ...
Claims
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IPC IPC(8): H05K3/14H05K3/18
CPCH05K3/14H05K3/182H05K3/187
Inventor 肖渊李红英张威王盼
Owner XI'AN POLYTECHNIC UNIVERSITY